Efficient Automotive MOSFETs with Top-Side Cooling

Infineon, a leading semiconductor manufacturer, has set its sights on automotive power control with the introduction of a new 5 x 7mm top-side cooled surface-mount package. This new package, known as SSO10T, is designed to compete with the existing 5 x 6mm bottom-cooled SSO8 package in the market.

The SSO10T package features a unique design with a 10μm gap instead of a thermal pad on the PCB side. According to Infineon, approximately 95% of the heat generated by the device will dissipate through the top of the package. This heat is typically directed towards the ECU housing or a cold-plate, ensuring efficient thermal management.

To ensure optimal performance, the SSO10T package is recommended to be used with a thermal interface pad. This pad helps accommodate any tolerance variations between the PCB and the heatsink surface, ensuring effective heat transfer.

"SSO10T is based on the industry standard SSO8," stated Infineon. "However, due to its top-side cooling design, the SSO10 offers a significant performance improvement of more than 20% and up to 50% compared to the standard SSO8, depending on the thermal interface material and its thickness."

One of the key advantages of the SSO10T package is the elimination of the need for thermal patches and thermal vias on the PCB. This advancement allows for simpler design implementations, with some applications being able to utilize basic double-sided PCBs, reducing complexity and cost.

Infineon has already introduced four MOSFETs in the SSO10T package, all of which are 40V n-channel devices. These MOSFETs are designed to operate efficiently in automotive applications, providing reliable power control and thermal management.

All performance specifications provided by Infineon are based on a standard operating temperature of 25°C. While the nominal current limit is rated at 120A, this value can be influenced by external thermal design considerations. The die limit is also specified in brackets, with the devices capable of handling higher current pulses for short durations.

The internal construction of the SSO10T package features a soldered copper-clip, ensuring robust electrical and thermal connections. This construction is visible in the underside view of the package, showcasing the quality and reliability of the design.

The SSO10T package is expected to find applications in a variety of automotive systems, including brushless DC drives, electric power steering, DC-DC converters, safety switches, and reverse battery protection circuits. Its JEDEC number allows for easy identification and second-sourcing of compatible devices.

For more information on the SSO10T package and its capabilities, interested parties can visit Infineon's website. The second video on the page provides detailed insights into the features and performance of the package, with key information starting at approximately 4 minutes into the video.