CEA-Leti Initiates FAMES Pilot Line Project

CEA-Leti has recently initiated a pilot line dedicated to advancing next-generation low-power and sensor process technologies. Known as the FAMES Pilot Line, this project aims to develop a range of cutting-edge technologies that will shape the future of integrated circuits.

The FAMES Pilot Line is set to introduce five new sets of technologies, including advancements in 10nm and 7nm FD-SOI, embedded non-volatile memories, small inductors for DC-DC converters in Power Management Integrated Circuits (PMIC), as well as OxRAM, FeRAM, and MRAM embedded memories. Additionally, the pilot line will support two 3D integration options, heterogeneous and sequential integration, along with RF components such as switches, filters, and capacitors.

Supported by the EU Chips Joint Undertaking and various member states, the FAMES pilot line has garnered backing from 43 companies across the electronic-systems value chain. These companies range from materials providers and equipment manufacturers to fabless companies, EDAs, IDMs, and system houses, all expressing formal support for the initiative.

Stakeholders interested in leveraging the FAMES pilot line will have access to the facility located in Grenoble, France. End-users from diverse sectors including IT, automotive, medical devices, space, and security markets are expected to benefit from the technological advancements facilitated by the pilot line.

The FAMES consortium, led by Leti in collaboration with partners such as imec, Fraunhofer Mikroelektronik, and others, is poised to drive innovation in the semiconductor industry. The introduction of the five new technologies is anticipated to create market opportunities for a wide range of applications, including low-power microcontrollers, AI devices, RF components, chips for 5G/6G, automotive solutions, smart sensors, and more.