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Revolutionary 1mm Thin Micro-Cooling Chip Fan Unveiled

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August 20, 2024

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xMEMS Labs has introduced a groundbreaking innovation in the form of an all-silicon, active micro-cooling fan tailored for ultramobile devices and next-generation artificial intelligence (AI) designs. The xMEMS XMC-2400 µCooling active microfan, with a mere 1mm thickness, is poised to revolutionize thermal management in smartphones, tablets, and other mobile devices through the utilization of piezo micromachines structures.

Joseph Jiang, the CEO and Co-Founder of xMEMS, emphasized the significance of this development, stating, “Our revolutionary µCooling ‘fan-on-a-chip’ design arrives at a crucial juncture in mobile computing. Ultramobile devices, now tasked with running increasingly processor-intensive AI applications, face a significant challenge in thermal management. Prior to the XMC-2400, the absence of an active-cooling solution was notable due to the compact and slim nature of these devices.”

The XMC-2400, measuring a mere 9.26 x 7.6 x 1.08 millimeters and weighing less than 150 milligrams, stands out as a compact and lightweight alternative, being 96 percent smaller and lighter than non-silicon-based active-cooling options. A single XMC-2400 chip boasts the capability to move up to 39 cubic centimeters of air per second with 1,000Pa of back pressure, offering semiconductor reliability, part-to-part uniformity, high robustness, and an IP58 rating.

xMEMS’s µCooling technology shares the same fabrication process as the xMEMS Cypress full-range micro speaker designed for active noise cancellation in wireless earbuds, set to enter production in Q2, 2025, with multiple customers already committed to the product.

Looking ahead, xMEMS plans to provide samples of the XMC-2400 microfan to customers in Q1, 2025. Jiang expressed confidence in the company’s trajectory, stating, “Having successfully introduced MEMS micro speakers to the consumer electronics market, with over half a million units shipped in the initial 6 months of 2024, we are now reshaping perceptions of thermal management. The XMC-2400 is engineered to actively cool even the most compact handheld devices, facilitating the development of ultra-thin, high-performance, AI-enabled mobile devices. The integration of xMEMS µCooling technology is set to redefine the landscape of tomorrow’s smartphones and other sleek, performance-driven gadgets.”

With a portfolio boasting over 150 granted patents globally, xMEMS continues to lead the way in technological advancements. For more information, visit xmems.com.

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