Attopsemi Expands I-fuse OTP Portfolio on X-FAB Platform

X-FAB Silicon Foundries SE and Attopsemi Technology have jointly announced the successful demonstration of the latest version of the I-fuse S3® one-time programmable (OTP) IP from Attopsemi based on the X-FAB XH018 technology platform. This achievement provides X-FAB customers greater flexibility when choosing the optimal OTP for their designs. Following a previous announcement of the demonstration and availability of the I-fuse S3® OTP based on 3.3-V devices, this new design uses 1.8-V devices – reducing the footprint by a factor of four compared to the existing version. Both versions are available in different memory densities, ranging from 8 bits to 8K x 8 bits (64K bits).

The I-fuse S3® OTP (where S3 means “super-small and scalable”) is an innovation in peripheral design that complements the I-fuse® cell technology. A novel array architecture enables a compact form factor and scalability, closely following Moore’s Law for small to medium-sized OTP applications. I-fuse S3® OTP is incorporated into the X-FAB XH018 process, a powerful modular sensor and high-voltage EPI technology, supporting an extended temperature range from -40°C to 175°C. It features a modular 1.8-V/3.3-V ultra-low-noise process designed for automotive-grade, industrial, and medical applications.

“The high reliability and high-temperature capability of this X-FAB process supports our unprecedented I-fuse® OTP performance,” said Shine Chung, Chairman of Attopsemi. “It is very encouraging to see that our collaboration has already triggered new projects with mutual customers in industrial and consumer areas and that it is starting to support new opportunities in the medical sector as well. With the IP proven functional up to 150°C, it also has the potential to enable additional opportunities in automotive applications”.

Nando Basile, Product Marketing Manager for Memory Solutions at X-FAB, added: “Expanding Attopsemi’s I-fuse® IP on our XH018 technology gives our customers more options to integrate and embed proven third-party IP into their designs. This helps optimise time-to-market while maintaining a cost-effective approach with no mask adders to the X-FAB core process. This IP is a perfect fit for our NVM portfolio, complementing our automotive-focused OTP and multi-programmable solutions like Flash and NVRAM. We’re seeing growing interest in industrial, IoT, and medical applications where a small form factor is of paramount importance.”

With the successful demonstration of the I-fuse S3® OTP based on the X-FAB XH018 technology platform, customers now have access to a more efficient and compact OTP solution for their designs. The transition to 1.8-V devices offers a significant reduction in footprint, making it an attractive option for various applications. The innovative array architecture of the I-fuse S3® OTP ensures scalability and a compact form factor, aligning with the evolving needs of the industry for small to medium-sized OTP applications.

Moreover, the incorporation of the I-fuse S3® OTP into the X-FAB XH018 process highlights the commitment to high reliability and performance in challenging environments. The extended temperature range from -40°C to 175°C opens up new possibilities for applications in automotive, industrial, and medical sectors. This collaboration between X-FAB and Attopsemi has already sparked interest among mutual customers, leading to the exploration of new projects and opportunities across different industries.