Low profile cabling under AI cooling system

Samtec has introduced a groundbreaking low profile cable assembly designed to fit underneath the cooling system of high-power AI chips. The Si-Fly LP cable-to-board assemblies boast a mated height of just 4.35 mm, enabling flexible mounting options near the IC package. This allows for secure placement under heat sinks or other cooling hardware in scenarios where z-axis height is limited.

In high-speed Data Center, HPC, and AI applications, signal reach and integrity are paramount, making the Si-Fly LP a crucial component. Samtec collaborates closely with system architects early in the design process to develop tailored solutions for cable management and thermal load distribution, recognizing that each application is unique.

Each Si-Fly LP cable assembly delivers an impressive 112 Gbps PAM4 channel rate in a 2-row, 16-pair configuration, supporting aggregate data rates of up to 896 Gbit/s (x8 bi-directional) or 1.79 Tbit/s (x16 uni-directional). Furthermore, these assemblies are PCIe 6.0/CXL 3.2 capable. By leveraging high-density, high-performance Flyover cable technology to route signals from the chip, thermal challenges are minimized, board layout is simplified, and overall costs are reduced.

One of the key features of the Si-Fly LP cable assemblies is Samtec’s proprietary 34 AWG, 92 Ohm ultra-low-skew Eye Speed twinax cable. This innovative cable design enhances signal integrity performance through co-extrusion techniques that optimize symmetry between signal conductors and shielding, resulting in remarkably low intrapair skew.

For those interested in incorporating the cutting-edge Si-Fly LP cable systems (CPC, CPI) into their projects, Samtec has these products readily available in stock. This availability ensures that engineers and designers can seamlessly integrate these advanced cable assemblies into their high-performance computing systems without delay.