ROHM GaN licensing brings TSMC process to Hamamatsu

ROHM is making a significant move by incorporating TSMC’s gallium nitride process technology into its own manufacturing flow. This decision sheds light on the direction in which the power-device market is evolving. Through a new license agreement, the Japanese chipmaker plans to transfer the process to ROHM Hamamatsu and aims to establish an end-to-end in-group production system by 2027.

ROHM GaN licensing shifts production control

The primary message behind this move is to enhance supply security. ROHM stated that the agreement is designed to bolster its capacity to meet the increasing demand for GaN power devices in various applications, such as AI server power units and electric-vehicle systems. The company is already engaged in mass-producing 150 V GaN devices at Hamamatsu and has been utilizing a 650 V process from TSMC since 2023. Now, it seeks to expand this capability within its own facilities, as highlighted in the company’s announcement.

From a strategic perspective, this decision makes perfect sense. GaN technology has transcended its traditional use in phone chargers and compact adapters. It is now being integrated into higher-voltage, higher-frequency designs where efficiency, switching speed, and smaller magnetics play a crucial role, especially in AI infrastructure and automotive power conversion. In this context, relying heavily on external wafer capacity may no longer be the most viable option.

ROHM GaN licensing builds on earlier TSMC ties

This move is not happening in isolation. As previously covered by eeNews Europe during the collaboration between ROHM and TSMC on automotive GaN, the two companies had already strengthened their partnership in December 2024 concerning development and volume production for electric-vehicle applications. The new agreement represents a further step in this collaboration by transferring process expertise into ROHM’s internal production environment.

There is a broader industry perspective to consider as well. TSMC’s GaN technology is increasingly being disseminated through licensing agreements rather than solely as a foundry service. For instance, GlobalFoundries entered into its own technology licensing deal with TSMC in late 2025 for 650 V and 80 V GaN. This trend indicates a more extensive restructuring of the GaN supply chain, with process intellectual property being transferred to manufacturers seeking greater control over capacity, roadmap, and geographical considerations.

What it means for GaN power devices

For ROHM, the appeal is clear: enhanced control over production processes, closer alignment between process and device design, and reduced vulnerability to supply chain disruptions as demand escalates. From a market perspective, this development signifies that GaN technology is transitioning into a more industrial phase, where manufacturing strategies are almost as critical as transistor performance. While the allure of GaN lies in its efficiency and compact power conversion capabilities, the underlying reality is that there is a pressing need for adequate production capacity in the right locations and at the right times.