Automotive MOSFET lineup expands with ROHM HPLF5060 package

ROHM has recently expanded its automotive MOSFET portfolio by introducing 40V and 60V power devices designed for vehicle systems. These new devices come in a compact surface-mount package, with the aim of enhancing board-level robustness. This move is a response to the increasing pressure on designers to reduce the size of power stages while maintaining reliability in the challenging environments found in automotive applications.

For readers of eeNews Europe who are involved in projects related to inverter control, pumps, or lighting modules, the packaging approach of these new MOSFET devices is just as important as the silicon itself. This is especially true in situations where assembly yield and inspection processes are critical for the success of the project.

Focus on Board-Mount Reliability with a Smaller Footprint

ROHM has introduced automotive MOSFET devices in its HPLF5060 package, which measures 4.9mm × 6.0mm. These 40V and 60V components are specifically designed for applications such as main inverter control circuits, electric pumps, and LED headlights. While smaller packages like the 5060-size are becoming more common in automotive designs, the tighter terminal spacing and leadless formats can pose challenges for mounting and inspection processes.

The HPLF5060 package is positioned by ROHM as an alternative to the widely used TO-252 package, which is larger at 6.6mm × 10.0mm. By utilizing gull-wing leads, this new package aims to improve solder joint visibility and board-mount reliability while also reducing the overall footprint of the device.

These new devices leverage copper clip junction technology to enable high-current operation in compact form factors. This feature can assist designers in balancing current capability and thermal performance within the constraints of PCB area, particularly in 12V and 48V subsystems.

Mass production of products utilizing the HPLF5060 package commenced in November 2025, with distribution channels including DigiKey and Farnell offering these devices to customers.

Expanding Package Options for Automotive MOSFETs

Looking beyond the HPLF5060 package, ROHM is working on introducing additional package options for its automotive MOSFET lineup. Mass production of a smaller DFN3333 package, measuring 3.3mm × 3.3mm and featuring wettable flank technology, is scheduled to begin around February 2026. Wettable flanks are crucial for supporting automated optical inspection, a key requirement in automotive assembly lines.

On the higher-power end, development is underway for a TOLG (TO-Leaded with Gull-wing) package sized at 9.9mm × 11.7mm. This signals a parallel effort by ROHM to cater to applications where higher current ratings and mechanical robustness are prioritized over miniaturization.

These new package options are part of ROHM’s EcoMOS silicon power MOSFET brand, which encompasses devices for automotive, industrial, and appliance systems. As vehicle architectures continue to advance, the packaging strategy is expected to play a crucial role in differentiating products, especially in areas where reliability, inspectability, and thermal performance intersect.