GloFo plans to create advanced packaging center in New York

US foundry GlobalFoundries Inc. has said it plans to create a center for advanced packaging and test of chips within its Malta, New York, manufacturing facility.

The company said it plans to spend US$575 million backed by investments from the Department of Commerce and New York state to be able to test US-made photonic and electronic chips used in AI, automotive, aerospace and defense and other applications.

In addition, GlobalFoundries said it was budgeting US$186 million for packaging R&D at the facility over the next decade.

GlobalFoundries Advanced Packaging and Photonics Center (APPC) is expected to offer:

• Advanced packaging, assembly and testing for silicon photonics
• Advanced packaging, bump, assembly and testing for aerospace and defense customers under Trusted Foundry accreditation, allowing chips used in national security systems to never leave the US during production.
• Advanced packaging, wafer-to-wafer bonding, assembly and testing of 3D and heterogeneous integration chips.

New York state will provide up to US$20 million in support for the center, which is in addition to the previously announced $550 million in support for GF from the New York State Green CHIPS program. The Department of Commerce will provide up to US$75 million in direct funding to support the center, supplementing the previously announced GF award under the CHIPS and Science Act.