STMicroelectronics Expands Data Centre Power Portfolio

STMicroelectronics has expanded its 800 VDC power conversion portfolio for AI data centres, adding 12V and 6V architectures developed in line with NVIDIA’s reference design. The additions complement the company’s earlier 800 VDC to 50V stage and were highlighted at NVIDIA GTC 2026.

For eeNews Europe readers, the development reflects a broader shift toward higher-voltage distribution and more granular power delivery in AI infrastructure, where efficiency, density and system architecture are becoming tightly linked design constraints.

Multiple voltage domains emerge in AI server design

The move to 12V and 6V outputs points to increasing fragmentation in server power topologies. Rather than converging on a single intermediate bus, AI systems are expected to use a mix of 50V, 12V, and 6V rails depending on GPU generation, rack density, and thermal design.

This trend is tied to the adoption of 800 VDC distribution, which aims to reduce losses at the rack and data centre level while enabling higher compute density. Lower-voltage rails are then generated closer to the load, particularly near high-performance accelerators.

Reducing conversion stages and improving transient response

A key aspect of the 12V architecture is the removal of the traditional 54V intermediate stage. This could simplify power trees and reduce system-level losses, particularly in high-density racks.

The 6V approach, meanwhile, is intended for configurations where fast transient response is critical, such as large-scale training clusters. By placing conversion closer to the load, designers can potentially improve responsiveness under rapidly changing workloads.

ST said the expanded portfolio combines silicon, SiC, and GaN power devices with analog, mixed-signal, and control elements. The company also referenced earlier work on a GaN-based 800 V converter prototype, indicating ongoing efforts to increase power density and switching frequency in these architectures.

“As AI infrastructure compute scale continues to expand fast, it requires higher voltage distribution and greater density, which can only be achieved with system-level innovation for each of the different AI server form factors,” said Marco Cassis, President, Analog, Power & Discrete, MEMS and Sensors Group Head of STMicroelectronics’ Strategy, System Research and Applications, Innovation Office at STMicroelectronics. “With these new converters for 800 VDC power distribution, ST brings a complete set of solutions to support the deployment of gigawatt-scale compute infrastructure with more efficient, scalable, and sustainable power architectures.”