X-Fab Enhances Galvanic Isolation Process with CMOS Integration

X-FAB, a leading provider of foundry solutions, is expanding its galvanic isolation technology to meet the growing demand for robust and flexible isolation products. By leveraging its process optimized for discrete capacitive or inductive couplers, X-FAB can now integrate galvanic isolation elements directly with active circuits based on its XA035 technology.

This integrated approach offers greater flexibility in the design of isolation products, making it well-suited for emerging opportunities in renewable energy, electric vehicle powertrains, factory automation, and industrial power applications.

The XA035 technology, based on a 350nm process node, is particularly suitable for the fabrication of automotive sensors and high-voltage industrial devices. With its high-voltage signal isolation capabilities, it ensures long-term operational performance even in demanding environments.

This advancement enables the production of robust components that are AEC-Q100 Grade 0 compliant and industrial-rated, including digital isolators, isolated gate drivers, and isolated amplifier ICs. X-FAB provides a comprehensive Process Design Kit (PDK) that supports the new and improved process technology for all major Electronic Design Automation (EDA) vendors.

"We have observed a growing demand from our customers for reliable foundry solutions to design galvanically isolated products," says Tilman Metzger, a representative from X-FAB. "X-FAB has been successfully producing high-reliable isolation layers for discrete coupler implementations for several years. By leveraging the same process module, we can now offer even more flexibility by enabling the direct integration with CMOS circuits on the same die. We are also excited to see the first integrated customer products nearing production."