CGD Innovates GaN Thermal Boost Packages

Cambridge GaN Devices (CGD) has introduced two innovative packages for its ICeGaN integrated power devices, aimed at enhancing thermal performance. The DHDFN-9-1 (Dual Heat-spreader DFN) GaN package, developed specifically for CGD, features a thin design with dual-side cooling capabilities and a 10x10 mm footprint. Equipped with wettable flanks for easy optical inspection, this package offers low thermal resistance (Rth(JC)) and can be operated with bottom-side, top-side, or dual-side cooling methods. In comparison to the commonly-used TOLT package, the DHDFN-9-1 package excels in top-side and dual-side cooled configurations, providing designers with greater flexibility in their thermal management strategies.

Designed with a dual-gate pinout to facilitate optimal PCB layout and simple paralleling, the DHDFN-9-1 package enables customers to address applications requiring up to 6 kW of power with ease. On the other hand, the BHDFN-9-1 (Bottom Heat-spreader DFN) package offers bottom-side cooling and wettable flanks for convenient inspection. With a thermal resistance of 0.28 K/W and a 10x10 mm form factor, the BHDFN-9-1 package is comparable to the widely-used TOLL package in terms of thermal performance.

Enhancing thermal resistance performance brings several advantages to power device applications. By allowing more power output at the same RDS(on) value, devices can operate at lower temperatures, reducing the need for extensive heatsinking and ultimately lowering system costs. Moreover, lower operating temperatures contribute to increased reliability and extended lifetimes of the devices. In scenarios where cost is a limiting factor, designers can opt for a lower-cost component with a higher RDS(on) value while still achieving the desired power output.

According to Nare Gabrielyan, product marketing at CGD, "These new packages are part of our strategy to empower customers to utilize our ICeGaN GaN power ICs at higher power levels. Applications such as servers, data centers, inverters/motor drives, micro-inverters, and other industrial sectors are increasingly benefiting from the power density and efficiency advantages offered by GaN technology. However, these applications demand rugged, reliable, and easy-to-integrate devices, qualities that are inherent in ICeGaN and further supported by our new packages."

The debut of these innovative packages will take place at the upcoming PCIM exhibition at the Nürnberg Messe, showcasing CGD's commitment to advancing power device technology and meeting the evolving needs of various industries.