Eliyan Surpasses $100M Milestone in Chiplet Interconnect Technology

Chiplet interconnect pioneer Eliyan has reached a significant milestone by securing additional financial backing, bringing its total funding to over $100 million. This latest investment comes from VentureTech Alliance, following a successful Series B round in March that raised $60 million. The infusion of capital will be instrumental in advancing the commercialization of Eliyan's innovative Bunch of Wires technology and expanding its product line to include die-to-die (D2D), die-to-memory (D2M), and chip-to-chip (C2C) interconnect solutions.

"The value proposition and technical differentiation demonstrated by Eliyan in cutting-edge manufacturing processes, utilizing both advanced and standard packaging, has garnered significant interest within the AI chip ecosystem," stated Ramin Farjadrad, co-founder and CEO of Eliyan. "We are thrilled to receive such extensive financial and strategic backing from leading foundries and memory suppliers around the world."

Farjadrad further added, "As we embark on a new phase in the company's journey, preparing to launch our initial products for commercial use, we are witnessing a surge in demand for our approach to facilitating high-performance, energy-efficient interconnect solutions in multi-die architectures."

"Eliyan's groundbreaking technology for interconnecting multi-die architectures effectively addresses many of the critical manufacturing challenges related to packaging, scalability, and flexibility," remarked Kai Tsang, Managing Partner at VentureTech Alliance. "From the perspective of foundries, we recognize a substantial market potential for their technology to play a pivotal role in the evolving chiplet ecosystem."

With a focus on driving innovation and pushing the boundaries of chiplet interconnect technology, Eliyan is poised to make a lasting impact on the semiconductor industry. By leveraging its expertise in custom and standard memory and IO subsystem chiplets, the company is well-positioned to meet the growing demand for advanced interconnect solutions in an increasingly interconnected world.