Cutting-Edge Power Modules for AI Computing

Infineon has introduced new power modules that promise to revolutionize AI data centers by enabling true vertical power delivery (VPD) and offering the industry's best current density of 1.6-A per square mm. These modules, known as TDM2354xD and TDM2354xT, build upon the success of the TDM2254xD dual-phase power modules introduced earlier this year.

Data centers currently account for over two percent of global energy consumption, a figure that is expected to rise to around seven percent by 2030 due to the increasing demands of AI technologies. This projected energy consumption would be on par with the current energy usage of India. Efficient power conversion from grid-to-core is crucial for achieving superior power densities and advancing compute performance while reducing the total cost of ownership (TCO). Infineon's new power modules are specifically designed to address these challenges.

According to Rakesh Renganathan, Vice President Power ICs at Infineon Technologies, "We are enabling high-performance AI data centers with our TDM2354xT and TDM2354xD VPD modules. These devices will maximize system performance with Infineon’s trademark quality and robustness, thereby enabling the best TCO for data centers. Our industry-leading power devices and packaging technologies, combined with our extensive systems expertise, will further advance high-performance and green computing as part of our mission to drive digitalization and decarbonization."

The TDM2354xD and TDM2354xT modules leverage Infineon's OptiMOS™ 6 trench technology, a chip-embedded package that enhances power density through improved electrical and thermal efficiencies. Additionally, a new inductor technology enables a lower profile for true vertical power delivery. These advancements set new benchmarks in power density and quality, enhancing the compute performance and efficiency of AI data centers. The TDM2354xT modules, supporting up to 160 A, are the industry's first Trans-Inductor Voltage Regulator (TLVR) modules in a compact 8- x 8-mm form factor. When paired with Infineon's XDP™ controllers, they deliver rapid transient response and reduce on-board output capacitance by up to 50 percent, further boosting system power density.

For those interested in exploring the capabilities of the OptiMOS dual-phase power modules TDM2354xD and TDM2354xT, samples are currently available. To learn more about these innovative power modules, visit www.infineon.com/aipowermodules.