Advanced packaging equipment plant opens in Germany

ERS electronic has opened a cutting edge production and R&D plant in Germany for its advanced packaging equipment.

ERS Barbing, sited near Regensburg, is coupled with a Competence Centre for Advanced Packaging and Advanced Backend technologies.

The centre will provide direct access to technical expertise in wafer and panel debonding, as well as warpage handling and measurement, with hands-on testing, demonstrations and collaborative projects. This includes expertise in thermal management, for example with wafer handling systems. 

“The opening of this facility underscores our dedication to advancing semiconductor technologies and supporting our customers in Europe and beyond,” says Laurent Giai-Miniet, CEO of ERS electronic. “Through firsthand demonstrations and personalized support, we aim to help our customers accelerate time-to-market and optimize manufacturing processes.”

“By combining production, R&D, and a Competence Centre under one roof, we are empowering our partners with the tools and knowledge needed to drive innovation and meet the growing demands of the industry,” said Imre Kosa, Site Manager of ERS Barbing.