Rohm collaborates on GaN TOLL packaging

Rohm has recently announced a collaboration with a Chinese assembly and test provider to develop 650V GaN HEMT power transistors in the innovative TOLL (TO-LeadLess) package. This partnership aims to enhance the packaging technology, which plays a crucial role in reducing on-resistance and improving the thermal performance of power transistors. The TOLL package is gaining popularity in applications that demand high power handling, especially in industrial equipment and automotive systems.

The GNP2070TD-Z, a product of the collaboration between Rohm and ATX Semiconductor (Weihai), leverages second-generation GaN technology obtained through a partnership with TSMC. This cutting-edge technology enables the device to achieve a remarkable figure of merit (RDS(on) x Q(oss)) of 2.90, which is half that of comparable devices in the market.

Having initiated mass production of its first generation of 650V GaN HEMTs in April 2023, Rohm has been making significant strides in the development of power stage ICs. These ICs integrate a gate driver and a 650V GaN HEMT into a single package, showcasing Rohm's commitment to innovation and in-house expertise.

With the automotive sector increasingly embracing GaN devices, a trend expected to accelerate in 2026, Rohm is strategically positioning itself to meet the growing demand. The company plans to expedite the introduction of automotive-grade GaN devices by strengthening partnerships with key players like ATX Semiconductor and intensifying its internal research and development efforts.

Expressing enthusiasm about the collaboration, Liao Hongchang, Director and General Manager at ATX, highlighted the fruitful partnership with Rohm. He emphasized the technical exchanges that began in 2017 and the potential for deeper collaboration in the future. This partnership underscores ATX's expertise in the back-end manufacturing of GaN devices and its commitment to supporting Rohm's automotive-grade GaN device development.

Satoshi Fujitani, General Manager of AP Production Headquarters at Rohm, emphasized the importance of collaborating with advanced technical partners like ATX to drive innovation in the dynamic GaN market. By combining Rohm's strengths with the technical capabilities of partners, the company aims to lead the way in delivering groundbreaking GaN devices to the market.