Amkor launches $7B semiconductor campus in Arizona

Amkor Technology has commenced construction on a massive new $7 billion semiconductor packaging and test campus in Arizona, expanding the company’s total planned investment and reinforcing its dedication to enhancing U.S. chip packaging capabilities. This new development, which now includes a second greenfield facility and additional cleanroom space, stands as one of the largest back-end semiconductor manufacturing investments in the country. Upon completion of both phases, Amkor anticipates the campus will generate up to 3,000 high-quality jobs in the region.

This initiative represents a significant milestone in reshoring advanced packaging capabilities to the U.S., a crucial segment of the semiconductor supply chain that has traditionally been concentrated in Asia. The move not only creates fresh opportunities for European suppliers but also for technology partners linked to AI, mobile, and automotive chip ecosystems.

A cornerstone for U.S. advanced packaging

Situated in Arizona’s burgeoning high-tech corridor, the new Amkor campus is set to become the first high-volume advanced packaging and test facility in the U.S. Construction of the initial plant is expected to be finalized by mid-2027, with production slated to commence in early 2028. The site will leverage smart factory technologies, scalable production lines, and advanced packaging processes to cater to major customers like Apple and NVIDIA.

“This groundbreaking marks a significant stride in Amkor’s long-term growth and innovation strategy,” stated Giel Rutten, president and CEO of Amkor. “We are constructing a facility to meet the most advanced needs of our customers, which will play a role in shaping the future of semiconductor manufacturing in the United States.”

The investment is bolstered by the CHIPS for America Program, the Advanced Manufacturing Investment Tax Credit, and various local and state government incentives. With plans for over 750,000 square feet of cleanroom space spread across both phases, Amkor’s Arizona site will serve as a cornerstone for an end-to-end semiconductor manufacturing ecosystem alongside TSMC’s wafer fab in Peoria.

Industry and government leaders back expansion

The groundbreaking ceremony saw the participation of top U.S. officials and semiconductor executives. U.S. Secretary of Commerce Howard Lutnick remarked, “Our collaboration with Amkor will introduce high-volume advanced packaging to the U.S. for the first time, bolstering our leading AI industry capabilities and American innovation.”

Apple’s chief operating officer Sabih Khan added, “Factories across the United States are producing 19 billion chips for Apple this year alone, and Amkor’s new facility will package and test the Apple silicon produced at TSMC Arizona just down the road.”

NVIDIA founder and CEO Jensen Huang hailed the project as a defining milestone in “bringing this capability home,” emphasizing that “AI has sparked a new industrial revolution — and with it, the opportunity to reindustrialize America.”

Strengthening the semiconductor ecosystem

Through this investment, Amkor is solidifying its position as a leading outsourced semiconductor assembly and test (OSAT) provider while contributing to U.S. initiatives to onshore critical semiconductor manufacturing. Arizona officials, including Governor Katie Hobbs and Senators Mark Kelly and Ruben Gallego, lauded the project’s economic advantages and its role in positioning the state as a semiconductor powerhouse. Alongside TSMC, Intel, and other entities expanding in the region, Amkor’s project positions Arizona as a central hub for the next generation of advanced chip production.

Amkor Technology