Hybrid MCU SiP for Automotive HMIs Integrates Memory

Microchip has unveiled a new automotive-qualified System-in-Package device, the SAM9X75D5M, designed for display-heavy human-machine interface applications in vehicles and e-mobility systems. This innovative device combines an Arm926EJ-S processor with 512 Mbit of DDR2 SDRAM in a single package, making it a versatile hybrid MCU suitable for graphics-capable embedded designs.

For readers of eeNews Europe, this announcement holds significance as the demand for graphics-intensive cockpit displays, charger interfaces, and control panels continues to rise, even in cost-sensitive platforms like two-wheelers and compact EV systems. It also provides a practical pathway for developers transitioning from traditional microcontrollers to higher-memory, MPU-class designs without fully committing to more complex system architectures.

Microchip positions the SAM9X75D5M as a hybrid MCU solution tailored for display-driven automotive designs. Qualified to AEC-Q100 Grade 2 standards, this device is ideal for applications such as digital cockpit clusters, smart clusters for two- and three-wheelers, HVAC controls, and EV chargers, supporting displays up to 10 inches with an XGA resolution of 1024 × 768 pixels.

The key design concept behind the SAM9X75D5M is the integration of the processor and memory within the same package, eliminating the need for external DDR layout work on the PCB. This integration not only simplifies board design but also addresses concerns related to the sourcing and supply volatility of discrete memory components. Additionally, the SiP offers multiple display interface options, including MIPI DSI, LVDS, and parallel RGB.

Microchip presents the SAM9X75D5M as part of its hybrid MCU family, aiming to combine MPU-level processing power and higher memory density while maintaining a development model that aligns with traditional MCU workflows. This includes support for RTOS-based development as well as bare-metal software, providing flexibility for developers transitioning to more advanced designs.

Memory Integration and Connectivity

By directly integrating DDR2 memory into the package, Microchip enables designers to have more buffer space compared to typical MCU implementations while reducing board area when compared to using discrete memory solutions. The SAM9X75D5M is positioned as a migration option for applications that have surpassed the performance or memory limitations of standard MCUs.

Rod Drake, corporate vice president of Microchip Technology’s MPU business unit, emphasized the benefits of the SAM9X75D5M, stating, “Microchip’s SAM9X75D5M product redefines the standard for automotive-grade solutions, combining a high-performance processor with memory in a single package and bringing the benefits of a SiP to the automotive market.” Drake highlighted the advantage of a SiP in providing significantly more RAM buffer space than traditional MCU implementations, all within a compact PCB footprint.

Equipped with CAN FD, USB, Gigabit Ethernet, and support for Time-Sensitive Networking, the SAM9X75D5M also features integrated 2D graphics and audio capabilities. Microchip ensures seamless support for the device through MPLAB X, MPLAB Harmony, and various graphics frameworks such as LVGL, Altia, and Embedded Wizard, catering to diverse development needs in the automotive sector.