SEMI And Global Net Corp. Predict Strong Growth for Glass Core Substrates in AI Packaging

SEMI and Global Net Corp. (GNC) have released a new report pointing to strong long-term growth for glass core substrates as chipmakers look for new ways to support AI and high-performance computing (HPC) workloads.

The report, titled Glass Core Substrate Market and Development Trends, examines how glass-based substrates could emerge as a next-generation packaging technology for larger and more complex semiconductor packages. According to the study, the market could see a compound annual growth rate (CAGR) of 67.2% between 2028 and 2040.

For eeNews Europe readers, the report offers a useful snapshot of where advanced packaging technologies are heading as Europe continues investing in semiconductor manufacturing and R&D. It also highlights opportunities for materials suppliers, equipment makers and research organizations involved in heterogeneous integration and chip packaging.

Advanced packaging gains momentum

As transistor scaling becomes more difficult and expensive, semiconductor companies are increasingly turning to advanced packaging technologies to improve system-level performance. Glass core substrates are attracting attention because they may support larger package formats, finer interconnect density and improved dimensional stability compared with conventional organic substrates.

“As chipmakers look for new ways to improve system performance beyond traditional device scaling, advanced packaging has become a critical area of innovation,” said Clark Tseng, Senior Director of Market Intelligence, SEMI. “Glass core substrates are being evaluated as one possible solution for future high-end packages because they may help support larger package sizes, finer interconnects, and improved dimensional stability compared to conventional package-substrate materials. This new report helps industry stakeholders understand where glass core substrates may fit in the next phase of packaging technology and what challenges must be addressed to achieve broader adoption.”

The report suggests that initial production deployments could begin around 2028, initially targeting selected high-performance applications. The industry will then gradually expand adoption into larger and more advanced package architectures.

Global ecosystem takes shape

The study also highlights growing activity across the global semiconductor supply chain, with companies and research organizations in Asia, North America and Europe investing in glass core substrate development.

Areas covered include substrate manufacturing, glass materials, inspection systems, processing equipment and broader supply-chain infrastructure. The report also reviews potential applications in AI accelerators, advanced processors, co-packaged optics and image sensors.

Interest in glass substrates has risen sharply as AI servers and HPC systems require increasingly large chiplets and higher bandwidth connections. Conventional organic substrate technologies are beginning to face scaling limitations, particularly around warpage control and interconnect density.

SEMI said the report provides an independent assessment of the technology’s commercialization outlook, market potential and remaining technical barriers. The publication is available in English and Japanese through SEMI Market Intelligence.