FlexIC RFID inlays bring NFC to paper packaging

Tageos and Pragmatic Semiconductor have strengthened their collaboration by introducing new FlexIC-based RFID product lines tailored for NFC-enabled packaging and labels. The Tageos EOS Lite and EOS Zero Lite families leverage Pragmatic’s NFC Connect PR1301 chip, with the EOS-932 Zero Lite PR1301 emerging as the inaugural paper-based NFC inlay within the series.

For readers of eeNews Europe, this launch signifies a shift in RFID and NFC technologies towards applications in lower-carbon, high-volume packaging. It highlights the potential of flexible semiconductor technology in reducing material usage and facilitating widespread item-level connectivity.

Flexible NFC Solutions for Packaging

The EOS-932 Zero Lite PR1301 is specifically engineered for seamless integration into paper-based packaging and labels, enabling functionalities such as consumer interaction, product verification, and brand security. By combining a paper antenna with Pragmatic’s ultra-thin FlexIC, the inlay aims to provide NFC capabilities without altering the appearance or texture of the packaging significantly.

Tageos emphasized that the product was conceived at its Innovation Center of Excellence and represents the first in its lineup to incorporate Pragmatic’s NFC Connect PR1301 chip. The chip’s adaptable form factor makes it well-suited for curved surfaces, packaging, and integration at the product level, addressing challenges often encountered by traditional RFID or NFC designs in terms of cost, thickness, or recyclability.

The companies assert that the EOS Lite and EOS Zero Lite product families are designed to minimize material usage, carbon footprint, and expenses. This development could make NFC-based item identification more feasible for widespread adoption in retail, consumer goods, and logistics scenarios.

Enhancing Digital Identity at the Item Level

The broader market potential lies in establishing connections between physical products and digital services. NFC inlays enable consumers to engage with packaging using their smartphones, while offering brands opportunities for authentication, traceability, and customer interaction.

“Our close partnership with Pragmatic Semiconductor merges innovation with a strong commitment to sustainability, empowering customers to deploy highly scalable, cost-efficient, and genuinely sustainable NFC inlays for smart packaging applications,” stated Matthieu Picon, CEO of Tageos. “The introduction of the new FlexIC-based product lines EOS Lite and EOS Zero Lite exemplifies our journey towards success, unlocking fresh avenues for brands to engage with their customers through products and the consumer’s most personal device, the smartphone.”

“Introducing this innovation to the market marks a significant deployment of our FlexIC technology. In collaboration with Tageos, we are seizing the expanding opportunity to seamlessly embed intelligence at the item level and deliver sustainable, connected experiences at scale,” remarked David Moore, CEO of Pragmatic Semiconductor. “Together, we are shaping a new era of intelligent packaging, enabling direct consumer interaction with virtually any item to establish authenticity, foster trust, and unveil data-driven insights and transparency throughout the value chain.”

Prototype samples of the EOS-932 Zero Lite PR1301 are anticipated to be available upon request by the conclusion of Q2 2026, with plans for volume orders commencing in Q3 2026.