Mass Production of LPDDR5X DRAM Packages Empowering On-Device AI

Leveraging its extensive expertise in chip packaging, Samsung has unveiled a groundbreaking innovation in the form of ultra-slim LPDDR5X DRAM packages. These cutting-edge packages not only provide superior performance but also create additional space within mobile devices, enabling better airflow and thermal control. This development is particularly crucial for high-performance applications that incorporate advanced features like on-device AI.

YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics, emphasized the significance of this advancement, stating, "Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package."

One of the key highlights of Samsung's new LPDDR5X DRAM packages is their industry-leading thinness. With a 4-stack structure, these packages feature the thinnest 12 nm-class LPDDR DRAM in the market, reducing thickness by approximately 9% and enhancing heat resistance by about 21.2% compared to the previous generation product.

Through meticulous optimization of printed circuit board (PCB) and epoxy molding compound (EMC) techniques, Samsung has achieved a remarkable thinness of 0.65 mm for the new LPDDR DRAM package. This makes it the thinnest among existing LPDDR DRAM modules of 12GB or higher capacity. Additionally, Samsung's innovative back-lapping process has been employed to minimize the package height, further enhancing its compactness.

In line with its commitment to driving innovation in the low-power DRAM market, Samsung plans to supply its 0.65 mm LPDDR5X DRAM to mobile processor manufacturers and mobile device makers. As the demand for high-performance, high-density mobile memory in compact form factors continues to rise, the company aims to develop even thinner LPDDR DRAM packages, including 6-layer 24GB and 8-layer 32GB modules, to cater to the evolving needs of future devices.