New compact SiC MOSFETs with high-power TOLL package

ROHM has recently announced the expansion of its wide-bandgap portfolio with the introduction of the SCT40xxDLL SiC MOSFET series in a compact TOLL (TO-Leadless) package. These new devices offer enhanced thermal characteristics and higher voltage capability in a slimmer footprint, making them ideal for next-generation power designs in data-center, industrial, and energy-storage applications.

For engineers designing dense power electronics, this release represents a significant advancement in power device packaging, providing new possibilities for meeting demanding size, thermal, and efficiency requirements.

Enhanced power density for future systems

In various applications such as AI servers, ESS platforms, and compact PV inverters, engineers are confronted with increasing power demands and diminishing system sizes. ROHM asserts that the new TOLL-packaged SiC MOSFETs directly tackle these challenges.

Compared to traditional TO-263-7L packages with similar voltage ratings and R_DS(on) values, the TOLL devices offer approximately 39% better thermal performance, enabling higher power handling despite their compact design. Additionally, these components reduce PCB footprint by around 26% and achieve a device height of just 2.3 mm, making them suitable for slim power supplies where components must remain below 4 mm.

Aside from the mechanical advantages, ROHM highlights the extended electrical capabilities of the new devices. While typical TOLL MOSFETs are limited to 650 V, the SCT40xxDLL series supports up to 750 V, providing increased surge margin and allowing designers to lower gate resistance for reduced switching losses.

Expanded SiC options

The SCT40xxDLL range consists of six models with R_DS(on) values ranging from 13 mΩ to 65 mΩ, covering a wide range of power stages and circuit topologies, including totem-pole PFC circuits for high-efficiency server and telecom supplies. Mass production of these devices commenced in September 2025.

ROHM emphasizes that the devices are readily available through major distributors such as DigiKey, Mouser, and Farnell, facilitating easy adoption for design engineers across Europe. To expedite evaluation, simulation models for all six variants can be downloaded from ROHM’s website.