QSMP-25 Module Integrates STM32 MPU for Edge AI

Direct Insight has recently unveiled the QSMP-25, a compact 29 mm² QFN-style solder-down system-on-module (SoM) centered around STMicroelectronics’ second-generation STM32MP255F microprocessor. This STM32 MPU module integrates dual ARM Cortex-A35 processors with a Cortex-M33 microcontroller, NPU, and GPU, making it well-suited for secure edge AI, advanced multimedia, and industrial IoT applications.

For designers concerned with footprint, EMI compliance, and long-term industrial-grade operation, the QSMP-25 is a significant development. Its solder-down form factor and extensive peripheral support are designed to streamline layout challenges while meeting the rigorous demands of Industry 4.0 and edge-computing applications.

Hardware Features for High-Performance Edge Processing

The QSMP-25 boasts dual 1.5 GHz Cortex-A35 cores, a 400 MHz Cortex-M33 MCU, a 1.24 TOPS NPU for AI/ML tasks, and an integrated GPU capable of HD video playback at 60 fps. Additionally, it features dual MIPI-CSI camera inputs for high-resolution imaging and on-module memory with 1 GB LPDDR4 RAM and 4 GB eMMC storage.

This SoM, measuring 29 x 29 mm and 2.6 mm in height, operates on a single 3.3 V supply and supports a full industrial temperature range from –40°C to +85°C. The design prioritizes EMC performance, thermal efficiency, and cost-effectiveness, making it ideal for space-constrained and rugged environments.

Connectivity and Security for Industry 4.0

Connectivity options on the QSMP-25 include dual USB 2.0 (or USB 2.0 plus USB 3.0), PCIe, dual Gigabit Ethernet, UART, I²C, SPI, PWM, SAI, and three CAN channels. Security features cater to IoT and industrial applications, facilitating CRA-compliant system implementations.

The QSMP-25 STM32 MPU module comes with a dedicated Yocto Scarthgap build that incorporates a mainline Linux kernel, full sources, toolchain, and documentation. Direct Insight emphasizes that this software support is intended to expedite time-to-market and ensure long-term maintainability.

David Pashley, co-founder and Managing Director at Direct Insight, expressed, “This new QSMP-25 solder-down module provides an industrial-grade 64-bit solution for secure Industry 4.0 and advanced edge computing applications requiring high-end multimedia capabilities. By integrating high-performance connectivity, multimedia, and display features with a Yocto-build mainline Linux BSP, this SoM simplifies design and production, optimizing size and price with its QFN solder-down package while easing PCB layout and EMI compliance.”

Manufactured by Ka-Ro Electronics, Direct Insight’s longstanding partner, the QSMP-25 is currently available with development kits and comprehensive technical documentation, catering to developers looking to leverage its advanced capabilities for their projects.