SEMI FlexTech has recently announced the launch of a new request for proposals (RFP) with the aim of advancing flexible hybrid electronics (FHE). The project awards for this initiative range from $250,000 to $500,000 and are funded by the Army Research Laboratory (ARL). The focus of the RFP is on next-generation materials, additive processing, and flexible device technologies, reflecting the increasing interest in flexible and moldable electronics for both commercial and defense applications.
For professionals in the electronics design, materials engineering, and advanced manufacturing sectors, the RFP provides valuable insights into the direction of public-private investment within the emerging FHE ecosystem. This funding call underscores the importance of innovation in technology development and highlights the opportunities for collaboration between industry and research institutions.
The 2026 FlexTech RFP targets various technology areas, including flexible and moldable electronics, advanced bonding reliability, 2D materials, and novel flexible energy storage architectures. Evaluation criteria for organizations submitting proposals will focus on technical capability, experience, potential impact, collaboration value, and applicability in both industry and military markets.
The program aims to support a wide range of concepts, from high-risk disruptive innovations to more incremental developments that can lead to short-term improvements. FlexTech encourages partnerships among industrial companies, R&D organizations, and universities to foster innovation and accelerate the adoption of flexible hybrid electronics technologies.
Interested parties are required to submit full proposals by July 6, 2026. To assist potential applicants, FlexTech will conduct a live informational webinar on May 20 at 10:00 a.m. PDT to provide detailed insights into the proposal submission and review process. A recording of the webinar will also be available for registered attendees who are unable to participate in real-time.
FlexTech operates as an industry-led public-private partnership within SEMI, bringing together stakeholders from industry, government, and academia to drive the development of flexible hybrid electronics infrastructure and products. The collaborative nature of the initiative ensures that participants selected for funding retain ownership of the intellectual property generated through FlexTech agreements, fostering a culture of innovation and knowledge sharing.