Fidus Systems

Design Expertise:

Turnkey FPGA Solutions: Comprehensive design, verification, and documentation services.

Custom FPGA Solutions: Tailored designs to meet specific product requirements and performance goals.

High-Performance Computing: Expertise in multi-gigabit serial links, memory interfaces, and digital signal processing.

ASIC-to-FPGA Conversions: De-risking ASIC developments with prototyping and migration services.

Technologies:

Altera/Intel Tools: Quartus Prime, Quartus II (Qsys, DSP Builder, SignalTap).

AMD/Xilinx Tools: Vivado, Vitis, Vitis AI.

Lattice Tools: Radiant, Propel, Diamond.

Microsemi Tools: Libero SoC Design Suite.

Others: Synplify Pro, Mentor ModelSim, Questa, MATLAB/Simulink, NC-Sim, Verilog-XL, Synopsys Design Compiler.

How We Help: Fidus transforms your ambitious visions into high-performance realities with expert FPGA design and development, leveraging the latest technologies and methodologies to ensure first-time-right solutions.

Design Expertise:

-Schematic capture, component selection, and multi-layer PCB design for high-speed digital, analog, RF, and mixed-signal circuits.

-High-density interconnect (HDI) design, impedance control, and complex layer stack-ups.

-Design for manufacturability (DFM), assembly (DFA), and test (DFT).

Technologies:

-CAD tools: Cadence, Altium, Mentor Graphics.

-Signal integrity analysis: Agilent ADS, ANSYS HFSS, Cadence Sigrity.

-PCB types: Rigid, Flex, Rigid-Flex with materials like FR4, Polyimide, and high-speed dielectrics.

How We Help: Fidus delivers precise, efficient PCB layouts that meet stringent performance and quality standards, ensuring reliable products.

Design Expertise:

Embedded Systems Architecture: Design partitioning, coding, profiling, validation, debugging, and documentation. Example: Advanced automotive infotainment system.

Board Support Packages (BSPs): Development and integration for various hardware platforms. Example: Custom BSPs for industrial automation systems.

Kernel Space Device Drivers: Development for hardware peripherals. Example: Drivers for advanced sensor modules in medical devices.

Communications and Networking Protocols: Integration of protocol stacks for seamless data exchange. Example: TCP/IP and Zigbee stacks in smart home automation.

Real-Time Operating Systems (RTOS): Expertise in FreeRTOS, ThreadX, VxWorks, QNX, and Micrium. Example: RTOS for mission-critical aerospace applications.

Security Protocols: Implementation of secure boot, authentication, and encryption. Example: Secure payment processing device.

Technologies:

Operating Systems: Linux, Android, FreeRTOS, ThreadX, QNX.

Programming Languages: Embedded C/C++, Java, C#.

Platforms: ARM Cortex-A/M, RISC-V, STM32, Ti DSP, AVR, MSP430, PIC, ESP32, Nordic MCUs, Microblaze.

Development Tools: Jenkins, Bitbucket, GIT, Microsoft Visual Studio, LabVIEW, MATLAB/Simulink.

Embedded Software Libraries: Gstreamer, OpenGL, OpenCL, hardware-accelerated AI/ML.

How We Help: Fidus delivers high-quality, reliable embedded software solutions that meet all requirements and specifications on the first attempt, minimizing rework, reducing development costs, and accelerating time-to-market.

Design Expertise:

-Enclosure design, thermal management, and structural integrity.

-Thermal CFD/FEA for convective and conductive solutions.

-Structural FEA for designing strength and minimal weight.

Technologies:

-3D CAD tools: SolidWorks, Simcenter Flotherm.

-Materials: Plastics, metals, resins.

-Processes: Injection molding, bent metal, machining, casting.

How We Help: Fidus delivers manufacturable and cost-effective mechanical and thermal solutions, ensuring optimal product performance and reliability.

Design Expertise:

-Signal and power integrity analysis for high-speed designs.

-Pre-layout and post-layout simulations to identify and resolve issues.

-Expertise in high-speed interfaces, complex layer stacks, and emerging memory technologies.

Technologies:

-Simulation tools: Agilent ADS, ANSYS HFSS, Cadence Sigrity.

-High-speed interfaces: 32.75Gbps to 56Gbps, DDR4/5, GDDR6.

-Power integrity: Optimizing PCB stackup, decoupling capacitors placement, SSO noise reduction.

How We Help: Fidus ensures robust and reliable designs, meeting all signal and power integrity requirements for high-speed projects.

Design Expertise:

-Antenna design (Wi-Fi, Bluetooth, GPS, RFID, ZigBee).

-Analog discrete design, modulators, demodulators, and power amplifiers.

-Direct up/down conversion, high linearity power amplifiers, high sensitivity receivers.

Technologies:

-Design tools: Agilent ADS, ANSYS HFSS, Cadence.

-RF laboratory equipment: Network analyzers, signal generators, spectrum analyzers.

-Wireless standards: 802.11, Bluetooth, UHF/VHF, mmWave.

How We Help: Fidus provides efficient, cost-effective solutions for complex wireless designs, ensuring high performance and reliability.