NeuronicWorks

Canada

NeuronicWorks is a leading design engineering and manufacturing house established in 2009. NeuronicWorks provides turnkey, end-to-end, custom electronic product development and manufacturing services including hardware design, FPGA design, firmware design, software design, web and mobile app design, mechanical and industrial design, testing support, qualification and certification support, prototyping, PCB assembly, box assembly and mass manufacturing support. 

 

NeuronicWorks has over the years built strategic partnerships with renowned component manufacturers like Analog Devices, Nordic Semiconductor, Microchip, Telit, STMicro, SiliconLabs, Renesas, SiTime, Innophase, Soracom, and NXM Labs. We are also the partner design house for major distributors like Arrow, Avnet, Mouser Electronics and have partnered with accredited testing laboratories like Nemko, TUV and Megalab. 

 

NeuronicWorks’ talented team of engineers and designers offers strong expertise in building and creating innovative technologies, designs, and products from initial concept design to prototyping, certification, and manufacturing.

Services

Hardware Design

NeuronicWorks’ hardware design services covers the full scope of product development process from concept to prototyping, certification and manufacturing. Our team focuses on delivering high-speed, high-density, digital, analog, high-voltage and RF and wireless designs. We deliver designs that utilize complex, powerful microprocessors, FPGAs, DSPs, and complicated RF, analog, and power systems. 

Talk to us today about your transform high-speed, density and performance into low difficulty. Talk to us today about your analog, digital or mixed-signal project; your control or instrumentation needs; or your micropower or kilowatt idea. 

If you are looking at redesigning and review of older PCBA modules to use newer active components to replace obsolete, Not Recommended for New Design (NRFND) components, we can help.

 

Expertise

  • Multicore and multiprocessor based designs
  • High speed digital designs
  • Analog, digital, wireless, mixed signal design and simulation
  • Memory interfaces, e.g., DDR2, DDR3, DDR4, QDR
  • Low, medium, and high-speed interfaces
  • Radio Frequency (RF) design and antenna optimization
  • Sensors (temperature, humidity, pressure, accelerometers, light, pH, video (both matrix and linear), touch, position (absolute and incremental), force and torque, CO2, gamma and neutron, ultrasonic, short/long range RF and wireless communication, etc.)
  • Wireless interfaces (Wi-Fi, BT, BLE, NFC, LoRa, Zigbee, ANT+)
  • Display (AMOLEDs, PMOLEDs, e-Ink)
  • Power optimized designs, battery systems/chargers 
  • Component sourcing/ BOM planning and cost optimization
  • Component obsolescence analysis and redesign

 

Tools:

  • Cadence OrCAD
  • Mentor PADS
  • Altium Designer
  • Autodesk EAGLE

Firmware Development

Our firmware engineers specialize in firmware development and have created many on board solutions with embedded systems. We have experience with numerous embedded microprocessors and microcontrollers, including those from Silicon Labs, STMicroelectronics, muRata, TI, Microchip, Dialog, NXP, and Atmel. While we use mostly C/C++ for a variety of platforms, our expertise includes low- and high-level descriptive languages for bare-metal, RTOS and embedded environments such as Linux or FreeRTOS. We do extensive sensor and other peripheral system development.

 

Expertise

-BSP and Device driver development

-Communication Protocols (MIPI, UART, SPI, I2C, 1-Wire, PCM, PCIe, TCP/IP)

  • Communication Drivers
    • UART/RS-232
    • USB (host and device)
    • RS-485, CAN
    • SPI, Quad SPI
    • Cellular (2G, 3G, 4G/LTE)
    • Modbus RTU
    • NFC
  • Video interfaces (HDMI, MIPI)
  • Audio interfaces (I2S, SAI)

-Related TCP/IP Functions

    • TCP, UDP, SMTP, HTTP, MQTT, BACnet
    • TLS/SSL and IPsec security
    • Embedded HTTP server, including UX/UI design 
    • Communication of telemetry data with the cloud 
    • Over-the-air (OTA) firmware update

-RF & Wireless Communication (802.15.4 MAC, ZigBee, Zwave,Thread, Bluetooth, Wi-Fi, LoRa, NFC, RFID)

-WiFi Functions

-Data processing and DSP Algorithms

-Multi-Sensor Arrays

-User Interfaces and Custom Keyboards, Custom Displays and Human Machine Interfaces (HMI)

-Motor Drivers and Controllers

-Google Assistant, Amazon Alexa, IFTTT, Nest, Smart Things integration

-Communication with applications (Android, iOS, Windows)

-Cloud integration (AWS, Google, IBM, etc.)

 

Industry Standard Libraries

  • lwIP
  • OpenSSL
  • Mbed TLS
  • OpenCV
  • OpenVPN
  • TouchGFX
  • STemWin
  • Video4Linux2
  • GStreamer
  • CUDA

FPGA Design Services

We specialize in a wide range of applications including high speed data acquisition and processing, video processing, high speed memory and network interfaces, advanced algorithm development, ASIC prototyping and feasibility study, and much, much more.

 

We offer a great variety of services ranging from RTL design (using VHDL, Verilog, SystemVerilog and System C) to Testing and Verification so you can rest assured that your needs will be met. Our FPGA engineers have worked with a wide range of devices including those form Xilinx, Intel, Lattice, Gowin and are proficient in RTL design. We make use of a multitude of tools to save time and cost in our design: synthesis of Matlab/Simulink components, IP integration, ChipScope Pro, scripting for design automation and testing.

 

ASIC manufacturing is a very costly and time-consuming process. Our team of experts can reliably Prototype your ASIC design on an FPGA.

 

Expertise

-DSP algorithm development and digital signal processing in FPGAs

-Communication Protocols (MIPI, UART, SPI, I2C, 1-Wire, PCM, PCIe, TCP/IP)

  • Communication Drivers
    • UART/RS-232
    • USB (host and device)
    • RS-485, CAN
    • SPI, Quad SPI
    • Cellular (2G, 3G, 4G/LTE)
    • Modbus RTU
    • NFC
  • Video interfaces (HDMI, MIPI)
  • Audio interfaces (I2S, SAI)

-Related TCP/IP Functions

  • TCP, UDP, SMTP, HTTP, MQTT, BACnet
  • TLS/SSL and IPsec security
  • Embedded HTTP server, including UX/UI design 
  • Communication of telemetry data with the cloud 
  • Over-the-air (OTA) firmware update

-RF & Wireless Communication (802.15.4 MAC, ZigBee, Zwave,Thread, Bluetooth, Wi-Fi, LoRa, NFC, RFID)

-WiFi Functions

-Data processing and DSP Algorithms

-Multi-Sensor Arrays

-User Interfaces and Custom Keyboards, Custom Displays and Human Machine Interfaces (HMI)

-Motor Drivers and Controllers

-Google Assistant, Amazon Alexa, IFTTT, Nest, Smart Things integration

-Cloud integration (AWS, Google, IBM, etc.)

 

Tools

  • Xilinx Vivado and ISE 
  • MATLAB/Simulink
  • Chipscope
  • Quartus II 
  • Microblaze

PCB Layout Services

NeuronicWorks provides custom printed circuit board design and layout for analog, digital and mixed signal boards for various systems across applications. 

 

We can help you create your PCB designs from scratch, or help you optimize existing designs through engineering peer design reviews. Our IPC certified professionals are experts in seamlessly migrating schematics to intricate, highly functional PCB designs. We design PCB layouts from simple schematics to those incorporating complex technologies such as blind/buried/micro vias, buried capacitance, precisely controlled impedance, fiber-weave direction control, multi-laminate, or mixed technology stacks.

 

With in-house design and manufacturing capability, we offer services from PCB schematic design and PCB Board layout to testing, validation, certification, board fabrication and PCB Assembly taking responsibility for the entire PCB design and manufacturing process. 

 

Expertise

  • IPC CID accredited designers
  • Board type
    • Single side PCB
    • Double side PCB 
  • Layer counts
    • 2 to 32
  • Layer thickness
    • 1.6mm board thickness: 2-12
    • 2.4mm board thickness: 2-16
    • Up to 32 layers for the thick PCB
  • High Density Interconnect (HDI): Microvia, blind and buried vias, hidden vias, via-in-pad, flooded vias, buried capacitance 
  • Impedance control traces
    • 50 Ohm-single end, 75 Ohm-single end, 90 Ohm-differential pair, 100 Ohm-differential pair, 120-differential pair, 150-differential pair
  • Stackup 
    • 2 layers to 32 layers
  • Materials
    • FR4, Polyimide, high speed/low loss dielectrics, hybrid constructions (e.g., FR4/Rogers), RoHS
  • High Frequency materials
    • Extreme Low loss, High temperature, RF, Halogen-free laminates (e.g., Rogers) 
  • Types: Rigid, Flex, Rigid-Flex
  • Minimum trace. space, via sizes 
    • Minimum trace: 3.5mil
    • Space: 3.5mil
    • Through hole via sizes: 6mil (62 mil board)
    • Micro via: 6 mil, 4mil or less
  • Power dissipation consideration
    • Accurate Power Calculation and good power plane design.
  •  Thermal dissipation consideration
    • Thermal Vias on thermal pad, opened large copper, heatsink, heavy copper, Ventilation condition
  • Board thickness for rigid 
    • Standard: 0.4 mm to 2.4mm
    • Up to 6mm
  • Panelization and support traces for flexible boards
  • Employs DFM/DFA/DFT methodology     

 

Tools:

  • Altium designer
  • Cadence Allegro PCB designer
  • Mentor Graphics PADS and PADS Router
  • Cadence OrCAD PCB designer
  • Altium PCAD
  • Altium Protel
  • EasyEDA

Qualification and Certification

For electronic products to successfully enter into a market, they must meet minimum compliance standards as mandated by the regulatory authorities of the country the product is being exported to.

 

Certification of electronic devices requires incorporating specific design elements throughout the hardware, software, mechanics, RF and other systems.

 

Incorporating these design features from the first iteration of the device can reduce setbacks and can allow for an early assessment of performance and a high level of confidence in the product before the certification process.

 

There are different types of electronic product certifications such as FCC requirements for electronic products in North America, ISED for Canada, CE standards for electronic products in Europe, PTCRB network carrier certification for North America, Bluetooth SIG for global market, RoHS for global market, UL safety standard for North America among others.

 

At NeuronicWorks, we have the experience and expertise to determine the certification standards your product requires, and we design with that in mind. We ensure the design of the product meets certification standards and will guide you to prepare for, apply and obtain the necessary certifications and approvals. With years of experience and success, we can help you integrate certification into your product lifecycle no matter where you are in the process.

PCB Assembly

NeuronicWorks offers turnkey PCB Assembly services for prototype and high mix low volume manufacturing. We manage turnkey, end-to-end requirements, from procuring bare printed circuit boards and parts through to PCB assembly and testing as required. We also work on consignment orders and in both cases, work closely with our customers to offer high quality services and ensure the fastest possible lead-times.

 

Our PCBA and SMT production services provide state of the art designs incorporating best-in-class manufacturability and testability standards enabling faster NPD cycles and increasing NPI efficiency. For customers that require assistance with design schematics, our in-house team of engineers can consult to create / update the required schematics and PCB layouts to match customer requirements.

 

Our Design for eXcellence review process will ensure our clients have access to the best recommendations throughout the design, engineering, certification, prototyping and manufacturing process to ensure designs are market ready.

 

We also offer MyWorks, NeuronicWorks’ online portal for streamlined PCBA order and inventory management. With MyWorks, our customers can instantly request PCBA quotes, view available NWI stock of components, manage their own inventory of consigned components, access project status and related information.

 

Expertise

  • PCB Types: Rigid, Flexible, Stretchable
  • Mixed Technology (SMT/Thru-hole)
  • Lead-free (RoHS Compliant) assembly services
  • Maximum Format (length x width): 510 mm x 580 mm
  • BGA, μBGA, QFN, QFP, POP, 3D cavities, Lead frame, Pre-mounted, Pin-in-Paste, Broadband,  Flat chips
  • Components Range: 0.4 x 0.2 mm (01005) to 45 x 87.5mm
  • PCBA Turnaround time: 5 days*
  • Capacity: Up to 5000 a month