DER-IC Launches State-of-the-Art Packaging Center in Newport

Yesterday, the Driving the Electric Revolution Industrialisation Centre (DER-IC) South West and Wales celebrated the grand opening of its advanced packaging facility at the Compound Semiconductor Applications (CSA) Catapult’s Innovation Centre in Newport. The event was graced by the presence of the Secretary of State for Wales, David TC Davies, who emphasized the UK Government's commitment to supporting the compound semiconductor cluster in south Wales. He highlighted the importance of strengthening the supply chain within the UK to safeguard the industry and promote job creation.

DER-IC South West and Wales is a crucial component of the broader DER-IC network, which comprises four centers across the UK. These centers provide open access equipment, facilities, and expertise to the Power Electronics, Machines and Drives (PEMD) manufacturing supply chain. PEMD technologies are essential for driving electrification and achieving Net Zero, thereby contributing to the growth of the UK economy.

The official opening ceremony featured a comprehensive tour of the state-of-the-art facilities and engaging keynote speeches delivered by industry experts. Jayakrishnan Chandrappan, Head of Advanced Packaging at CSA Catapult, and Paul Jarvie, DER-IC South West and Wales Centre Lead, highlighted the cutting-edge equipment and specialized knowledge available at CSA Catapult.

One of the key highlights of the new DER-IC South West and Wales facility is its capability to serve as a prototype facility for developing semiconductor and compound semiconductor packages using advanced multi-material 3D printing techniques, including ceramic and metals. This innovative approach positions the center as a hub for pioneering technological advancements in the field.

The equipment showcased at the launch event included the center’s advanced 3D printing equipment suite, which is the first of its kind in the UK's open-access setting. This equipment facilitates the integration of various printing technologies for chip packages, heat sinks, and printed circuit board (PCB) designs, thereby enabling manufacturers to explore new possibilities in product development.

Already, the center has garnered significant interest from major industrial partners in the aerospace and transport sectors. Companies like Dycotec Materials and Carbon Forest Products are actively engaged in projects aimed at enhancing performance, reliability, and cost-effectiveness in automotive applications through innovative 3D printing processes. The potential for collaboration and innovation within the PEMD supply chain is immense, offering a platform for manufacturers to scale up their operations and drive commercialization.

In conclusion, the launch of the DER-IC South West and Wales facility marks a significant milestone in the advancement of semiconductor technologies in the UK. With a focus on innovation, technology development, and skills enhancement, the center is poised to play a pivotal role in shaping the future of the PEMD manufacturing supply chain. As the doors to the facilities are now open for utilization, manufacturers across the UK are encouraged to explore the opportunities presented by DER-IC. For more information on how to engage with DER-IC, visit www.der-ic.org.uk.