Softbank and NewPhotonics Join Forces for Advanced Photonics

Photonics-electronics convergence technology is at the forefront of revolutionizing high-speed optical communication and Optical Switching Technology, paving the way for low latency and low power consumption in AI data centers and mobile fronthaul infrastructure. SoftBank is leveraging these cutting-edge technologies, incorporating NewPhotonics patented innovations alongside its photonics integrated chip (PIC) to establish reliable all-optics communication and optical fabric switching.

By enhancing the performance of GPU/CPU/switch fabric through PIC and ensuring low latency optical connectivity, the photonics technology is poised to tackle power consumption and capacity bottlenecks in AI cluster workloads. The NewPhotonics optical SerDes (serializer/deserializer) is a key component enabling higher density and low latency data transfer in both mobile fronthaul and data center environments.

The integration of co-packaged advanced optical technologies is proving instrumental in improving speed and energy efficiency, particularly as data centers undergo redesigns to accommodate high-performance compute and vector processing applications. Moreover, the Long Periodic Optical (LPO) technology, facilitated by incorporating the NewPhotonics photonics integrated chip into optical transceivers, allows for long-distance transmission surpassing current LPO capabilities. Implementing NewPhotonics LPO technology in mobile fronthaul is anticipated to reduce processing delays, lower power consumption, and extend data transport distances.

Ryuji Wakikawa, Head of SoftBank Research Institute of Advanced Technology, emphasized the significance of the partnership with NewPhotonics, stating, "We believe this collaboration is essential for the next generation of infrastructure. Through our joint efforts, we anticipate a transformative impact on AI data centers and mobile fronthaul infrastructure, leveraging optical-electronics convergence technologies to enhance speed, capacity, distance limits, and sustainability, positioning SoftBank for substantial market leadership."

Yaniv Ben Haim, CEO of NewPhotonics, echoed this sentiment, noting, "Our collaboration agreement with SoftBank represents a major milestone for our company and the industry as we advance optical interconnect technology in CPO and pluggable solutions tailored to modern compute and AI infrastructure requirements. We are dedicated to pushing the boundaries of optical communication by reducing latency and power consumption while extending scalable distances. This partnership underscores our confidence in the transformative potential of all-optical connectivity in shaping the future of AI and 6G, leveraging our patented photonics innovations."