UMC launches new 55nm BCD platform

United Microelectronics Corporation (UMC) has recently unveiled its latest innovation in the form of a new 55nm BCD platform, also known as 55nm BCD technology. This cutting-edge technology is specifically engineered to enhance performance and power efficiency in the realm of next-generation mobile, consumer, automotive, and industrial devices. By introducing this new process node, UMC aims to assist designers in navigating the increasing complexity of power management, all while reducing chip area and enhancing noise performance.

This significant launch underscores UMC’s strategic move towards advanced specialty technologies that have the potential to significantly influence power IC design, mixed-signal integration, and system efficiency across a diverse array of electronics markets.

Enhancing the Power Management Toolbox

BCD technology plays a crucial role in enabling the coexistence of analog, digital, and power circuits on a single die, a fundamental requirement in power management and mixed-signal ICs. UMC’s new 55nm BCD platform takes this flexibility a step further by offering three distinct process variants tailored to meet various application needs.

The Non-Epitaxy (Non-EPI) process is geared towards providing a cost-effective solution that prioritizes power efficiency and analog performance, particularly for consumer and mobile devices. On the other hand, the Epitaxy (EPI) process is designed to support automotive applications with operating voltages reaching up to 150V, meeting the rigorous AEC-Q100 Grade 0 automotive standard for enhanced reliability in extreme operating conditions. Additionally, the Silicon-on-Insulator (SOI) process targets high-grade automotive and industrial systems, boasting AEC-Q100 Grade 1 compliance, exceptional noise suppression capabilities, and low leakage performance.

Moreover, the platform offers support for ultra-thick metal (UTM), embedded flash, and resistive RAM (RRAM) options, providing designers with increased flexibility in integrating memory and high-current paths for power applications.

Strengthening UMC’s Specialty Portfolio

Steven Hsu, Vice President of Technology Development at UMC, emphasized the significance of the 55nm BCD platform, stating, “The readiness of our 55nm BCD platform marks a major milestone for UMC, rounding out our specialty BCD technology portfolio and boosting our competitiveness in the power management market.” He further highlighted that UMC’s comprehensive 55nm BCD solutions offer competitive device performance, empowering customers to develop innovative power solutions for a wide range of applications, from smartphones and wearables to automotive, smart homes, and factories.

By introducing this new platform, UMC has expanded its BCD process portfolio to cover a wide range of voltage requirements suitable for diverse markets, ranging from 0.35µm down to 55nm. The combination of UMC’s extensive intellectual property, design enablement, and process maturity positions the foundry to effectively support the evolving needs of power electronics and mixed-signal IC manufacturers striving to enhance efficiency and integration.

For the design community in Europe, where efficiency, reliability, and integration are paramount to driving innovation, UMC’s 55nm BCD platform presents a timely upgrade path for the next generation of automotive and industrial power solutions.