AI data centres power trends at PCIM

Power is playing an increasingly crucial role in the design of various systems, ranging from AI data centers to e-mobility, drones, and robotics. The demand for more efficient power systems with higher levels of integration is evident at the PCIM conference and exhibition in Nuremberg, Germany, held in June. This event showcases advancements in power needs for AI data centers, lightweight battery power for e-mobility, and integrated power solutions for humanoid robots.

One notable technology making an impact is silicon carbide (SiC) with trench structures, which is helping to reduce the high cost of devices in AI data centers. Additionally, new architectures for gallium nitride (GaN) are enhancing the reliability of power systems while reducing size and weight for robotics applications. Renesas, for example, is ramping up its production capacity to meet the increasing demand for GaN technology, anticipating significant breakthroughs in the coming years.

Integration is a key trend in power devices, with companies like Toshiba Electronics Europe shipping engineering samples of devices that combine a microcontroller with power MOSFETs for applications like three-phase brushless DC motor drives in automotive systems. These integrated solutions aim to reduce component count and shrink the size of electronic control units for various automotive applications.

Advancements in battery health monitoring by companies like Texas Instruments are enabling longer battery life, enhanced safety, and prevention of critical failures in applications such as electric vehicles. GaN and SiC wide-bandgap technologies are delivering the efficiency and power density required for applications like bi-directional inverters and intelligent energy storage, complemented by edge AI for real-time control to optimize the grid.

In the realm of AI data centers, the power path from the grid to processors is evolving with emerging 800 VDC architectures to maximize power density and conversion efficiency. Infineon is showcasing semiconductor technologies at PCIM for efficient battery storage systems, solid-state transformers, and circuit breakers. Silicon carbide (SiC) is gaining traction for power applications in data centers, with Toshiba introducing a 1200 V SiC MOSFET tailored for power supply systems in AI data centers.

Automotive applications are also benefiting from power innovations, with companies like VisIC introducing third-generation d-mode GaN technology for improved efficiency and peak performance. The evolution of robotics towards physical AI systems is being supported by semiconductor solutions showcased at PCIM, enabling precise control and robust operation in future robotic applications.

Overall, the advancements in power technologies showcased at PCIM Europe are driving a new era of intelligent motion and AI platforms. From AI data centers to robotics and drones, GaN and SiC technologies are enabling more efficient, compact, and reliable power solutions across various industries, paving the way for the next generation of electrified platforms and high-density computing environments.