News Archive
AIchip launches 3DIC service
Alchip Technologies in Taiwan has formally launched its three-dimensional integrated circuit (3DIC) design services.The 3DIC service is aimed at for the latest high-performance ASICs targeting AI and high-performance computing (HPC) applications with multiple chips stacked vertically within a single package.The company has...
$1.4bn boost for US advanced packaging
The US Department of Commerce has announced $1.4bn for three projects and an Advanced Packaging Manufacturing Programme (NAPMP).This is intended to establish a self-sustaining, high-volume, domestic, advanced packaging industry where advanced node chips are both manufactured and packaged in the United States....
Brill Power launches battery management as a service
Brill Power has launched Battery Management as a Service (BMaaS) for energy storage systems.BMaaS links Brill Power’s Battery Intelligence Platform with the BMS hardware, operating system and cloud analytics under a unified interface. This allows battery integrators and owners to extract all the...
A Cat-Like Robot Mimicking Bunting Behavior
The behavior of a cat rubbing its head against a person, known as bunting, is an expression of affection and is believed to have a healing effect on humans – Tsukuba UniversityIn this study, researchers developed a robot that mimics this bunting...
Developing Printable Droplet Laser Displays
Researchers at University of Tsukuba have developed an innovative method for rapidly creating laser light sources in large quantities using an inkjet printer that ejects laser-emitting dropletsDisplays for TVs, PCs, and smartphones are continually improving in picture quality, clarity, and energy efficiency....
Kyocera backs TactoTek with $5m
Kyocera is backing Finnish In-Mold Structural Electronics (IMSE) developer TactoTek with $5m as part of the current $60m funding round.Kyocera is embedded its Haptivity I piezoceramic actuators within IMSE parts to combine force sensing and tactile feedback. Force sensing activates capacitive touch...
Exostiv Labs adds support for AMD Versal Adaptive SoCs
Exostiv Labs has added device support for AMD Versal™ Adaptive SoCs to its cutting-edge Exostiv massive FPGA capture and Exostiv Blade deep multi-FPGA capture platforms, including support for the world’s largest FPGA, the AMD Versal Premium VP1902.These platforms for FPGA debug, test...
Intel prepares to jettison venture capital arm
Troubled semiconductor company Intel Corp. has announced that Intel Capital, its venture capital arm, will become a stand-alone company in the second half of 2025.Intel will remain an investor in what will become an independent investment company that is expected to attract...
Infineon merges sensor and RF businesses
Infineon Technologies has formed a new business unit out of its Sensor and Radio Frequency (RF) operations.The SURF (Sensor Units & Radio Frequency) business is part of the Power & Sensor Systems (PSS) division and includes the former Automotive and Multi-market Sense...
German cognitive, humanoid robotics startup secures funding
NEURA Robotics has announced it has raised €120 million in a Series B funding round, highlighting its key role in cognitive and humanoid robotics and demonstrating how it is uniquely positioned to lead the European robotics industry and become a major force...
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