News Archive

ST begins silicon photonics production for AI data centers

ST begins silicon photonics production for AI data centers

STMicroelectronics has ramped up production of its silicon photonics platform, targeting the burgeoning optical interconnect market driven by the rapid expansion of AI infrastructure. The company has announced that its PIC100 technology is now being manufactured on 300-mm lines to cater to...

Published on: March 10, 2026

Cisco powers TPG Telecom ops with Splunk

Cisco powers TPG Telecom ops with Splunk

Cisco has announced that its Splunk platform will support TPG Telecom in building a next-generation Service Operations Centre across Australia. The deployment aims to boost network reliability, improve security visibility, and increase operational efficiency across the telco’s mobile and fixed infrastructure.The initiative...

Published on: March 10, 2026

Aliro Access Control Reference Design by Nordic Semiconductor

Aliro Access Control Reference Design by Nordic Semiconductor

Nordic Semiconductor has introduced a reference design intended to simplify the development of interoperable access control systems for smart buildings and connected environments. The design combines support for the Aliro standard with Matter-based device integration, potentially enabling developers to build mobile-credential access...

Published on: March 10, 2026

Elektor releases March April 2026 issue focused on embedded and AI

Elektor releases March April 2026 issue focused on embedded and AI

The latest edition of Elektor Magazine for March/April 2026 is now available, showcasing the cutting-edge advancements in embedded systems and artificial intelligence. This issue is a comprehensive resource for engineers, featuring a blend of practical design projects, engineering tutorials, and expert insights...

Published on: March 10, 2026

Arduino VENTUNO Q with Qualcomm IQ8 for Edge AI

Arduino VENTUNO Q with Qualcomm IQ8 for Edge AI

Arduino has used the eve of embedded world in Nuremberg to unveil the Arduino VENTUNO Q, a higher-end development platform aimed at what the company calls “physical AI”: systems that combine local inference with deterministic control for robotics, machine vision and industrial...

Published on: March 09, 2026

Elektor Releases March April 2026 Issue on Embedded Systems and AI

Elektor Releases March April 2026 Issue on Embedded Systems and AI

The latest issue of Elektor Magazine, released in March/April 2026, is a treasure trove for engineers interested in embedded systems and artificial intelligence. This edition is packed with cutting-edge developments, practical design projects, and expert insights aimed at helping engineers seamlessly integrate...

Published on: March 09, 2026

EV magnet market to reach $9.5 billion by 2030

EV magnet market to reach $9.5 billion by 2030

The global electric-vehicle (EV) magnet market is experiencing significant growth, driven by the rapid electrification of the automotive sector. A recent report from MarketsandMarkets projects that the market will expand from $5.3 billion in 2025 to $9.5 billion by 2030, with a...

Published on: March 09, 2026

Vector Microchip Collaboration for SDV Embedded Solution

Vector Microchip Collaboration for SDV Embedded Solution

Vector and Microchip Technology have announced an expansion of their collaboration to provide pre-integrated solutions for resource-constrained control units by combining embedded software and microcontroller platforms. The partnership involves supporting Vector’s MICROSAR IO software layer on Microchip’s dsPIC33A digital signal controllers (DSCs),...

Published on: March 08, 2026

Arm and Linaro launch CoreCollective consortium

Arm and Linaro launch CoreCollective consortium

Arm and Linaro have joined forces to establish CoreCollective, a new industry consortium aimed at streamlining engineering efforts and standardizing key components of the Arm software stack. This collaborative initiative, supported financially by Arm and operationally led by Linaro, serves as a...

Published on: March 07, 2026

Molex targets AI data centres with co-packaged copper solutions

Molex targets AI data centres with co-packaged copper solutions

As hyperscale data centres continue to expand to support artificial intelligence (AI) and high-performance computing, signal integrity and power efficiency are becoming increasingly crucial design constraints. Molex has introduced innovative copper solutions as a connectivity platform aimed at addressing these challenges in...

Published on: March 06, 2026

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