News Archive
Coherent reveals extensive InP technology range for future photonics
Coherent is gearing up to showcase its latest advancements in Indium Phosphide (InP) technology at OFC 2026, positioning itself as a crucial player in the realm of next-generation optical networking. The company is all set to unveil a diverse range of components...
DigiKey ST and Ultra Librarian Expand eDesignSuite Integration
DigiKey, STMicroelectronics, and Ultra Librarian have joined forces to enhance the eDesignSuite integration within ST’s browser-based design environment. The goal is to streamline the process from initial simulation work to bill-of-materials export and component purchasing. This collaboration aims to reduce the need...
Renesas introduces new 28nm automotive MCU
Renesas has recently introduced a new addition to its automotive MCU range, the RH850/U2C, targeting body, chassis, battery management, and safety-related control systems. This 28nm device is part of the RH850 family and is designed to cater to current electronic control unit...
Mixed signal IC for aerospace actuation systems
Microchip has unveiled the LX4580, a highly integrated device designed to streamline actuation control in aerospace and defense platforms. This new component combines multiple sensing, control, and monitoring functions into a single unit, reflecting a broader industry trend towards integration in mission-critical...
Ferrocene 26.02.0 Automotive Core Certification
Ferrocene 25.02.0 was released at embedded world 2025. Now, a week after we visited embedded world 2026, Ferrous Systems has released Ferrocene 26.02.0, extending the reach of qualified Rust tooling in safety-critical development by adding ISO 26262 ASIL B certification for a...
IAR expands DRIVECORE support for software-defined vehicles
IAR has announced an expanded collaboration with Infineon at embedded world 2026, focusing on its DRIVECORE software bundles and early support for AURIX RISC-V development. This partnership comes at a time when automotive software complexity is on the rise, driving the need...
ROHM unveils SiC reference designs for high-power three-phase inverters
ROHM has introduced a set of new reference designs targeting three-phase inverter applications built around its latest SiC power modules. The designs aim to simplify development workflows while accelerating evaluation and implementation, the company notes.For eeNews Europe readers working on high-efficiency power...
New SEMI Europe partnership targets semiconductor expansion in Poland
SEMI Europe has signed a two-year agreement with the Polish-Taiwanese Chamber of Commerce to boost semiconductor development in Poland, signaling growing momentum for Europe’s chip ambitions. The partnership comes as global players continue to diversify supply chains and invest in new regional...
“NVIDIA Advances Physical AI in Robotics Deployments”
NVIDIA is making significant strides in the realm of “physical AI,” with the introduction of new simulation frameworks and foundation models, as well as expanded partnerships with key players in the robotics industry. This move, unveiled at GTC, signifies a shift from...
Vector adds VDV 261 support for electric bus preconditioning
Vector Informatik, in collaboration with Hubject, has enhanced its vCharM charging and energy management platform for electric bus fleets by incorporating VDV 261 preconditioning support. This update introduces automated certificate management and network compatibility features aimed at streamlining deployment within current depot...
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