Julie Rogers has been appointed as the new Executive Director of the Electronic System Design Alliance (ESDA) by SEMI, enhancing the leadership team for the electronic design automation (EDA) and semiconductor design ecosystem. She takes over from Robert P. Smith, who will...
Tageos and Pragmatic Semiconductor have strengthened their collaboration by introducing new FlexIC-based RFID product lines tailored for NFC-enabled packaging and labels. The Tageos EOS Lite and EOS Zero Lite families leverage Pragmatic’s NFC Connect PR1301 chip, with the EOS-932 Zero Lite PR1301...
China is pressing its chipmakers to use more domestic silicon wafers, with a reported target for local suppliers to provide 70% of wafer demand in 2026. According to Nikkei Asia, the target has become an informal mandate among Chinese chipmakers, especially for...
The Electronic System Design Alliance (ESD Alliance) is putting agentic AI firmly in the spotlight at its 2026 Executive Outlook, signaling how quickly the technology is moving into mainstream chip development. Scheduled for June 10 in San Jose, the event will gather...
Microchip has recently introduced the dsPIC33AK256MPS306 digital signal controllers as part of its dsPIC33A family, with a focus on high-density power conversion, motor control, and intelligent sensing designs. These devices are designed to offer real-time control, integrated analog functions, and support for...
The sensiBel MEMS microphone is moving towards higher-volume production through a supply-chain relationship with Silex Microsystems, the Swedish pure-play MEMS foundry. The Norwegian optical MEMS sensing company announced the manufacturing relationship on 4 May 2026, saying Silex will manufacture the MEMS element...
Worldwide silicon wafer shipments experienced a robust start to 2026, with a notable 13.1% year-on-year increase in the first quarter, as reported by SEMI. This growth underscores the ongoing momentum in AI-related semiconductor demand, even amidst challenges faced by certain end markets.For...
Advantech is enhancing its industrial embedded boards and edge AI systems by incorporating Intel Core Series 3 processors, with a focus on supporting lightweight edge AI inference in applications with space and power constraints. This move provides insight into how mainstream processor...
Emerson has unveiled a groundbreaking software-based approach to validating aerospace communication systems, with the aim of transitioning more RF testing from field environments to controlled lab settings. The NI Channel Emulator System Software (CHESS) platform made its debut at the 2026 Space...
Forsee Power is expanding its reach beyond traditional vehicle applications by supplying its GO 1.6 battery system to Tohatsu for use in a new electric portable fire pump. This move signifies another advancement in the electrification of industrial equipment, showcasing the versatility...