News Archive
NVIDIA and Corning partner on AI photonics expansion
NVIDIA and Corning Incorporated have recently announced a significant long-term partnership aimed at expanding US manufacturing capacity for optical connectivity technologies crucial in AI infrastructure. This collaboration comes at a time when hyperscale data center operators are accelerating the deployment of GPU-based...
Infrared LEDs for Vehicle Safety
In-cabin sensing is evolving from a mere comfort feature to a crucial component of vehicle safety systems. ams OSRAM is strategically positioning its OSLON Black IR:6 C-Series infrared LEDs for camera-based driver and occupant monitoring applications, emphasizing the significance of low-visibility illumination...
Quantum Brilliance CEO Mark Luo on Deployable Quantum Systems and Diamond-Based Computing
Quantum computing has long been hailed as a revolutionary technology, yet most existing systems are large, intricate machines that require extreme conditions to operate. Quantum Brilliance, however, is charting a different course by developing compact quantum processors made from synthetic diamond that...
Anthropic Compute Deal with SpaceX AI Colossus 1
Anthropic has signed a compute agreement with SpaceXAI to use all of the capacity at Colossus 1, the Memphis AI data centre originally built around xAI infrastructure. The Anthropic compute deal gives Claude access to more than 300 MW of additional capacity...
SEMI Summit spotlights Europe’s chiplet and packaging push
Europe’s semiconductor industry is gearing up for the SEMI 3D & Systems Summit in Dresden, Germany, set to take place from June 17–19. This event will shine a spotlight on advanced packaging and heterogeneous integration, bringing together key players in the industry...
“NXP CoreRide Adds Vector Software Support for SDV Platforms”
NXP CoreRide is gaining additional embedded software support from Vector as the two companies expand work on software-defined vehicle platforms. The collaboration focuses on pre-integrated software stacks, system integration and update architectures for zonal vehicle designs.For eeNews Europe readers, the work is...
Elektor Lab Talk on Red Pitaya and Test Gear
Elektor is excited to announce an upcoming Lab Talk event featuring Red Pitaya’s Miha Gjura. Lab Talk #46: Red Pitaya and Reconfigurable Test Gear is scheduled for Wednesday, May 13, 2026, at 16:00 CEST. During the live session, the focus will be...
ASML CEO supports Europe tech competitiveness push
A group of leading European technology CEOs, including ASML chief Christophe Fouquet, has issued a joint call for urgent policy action to strengthen Europe’s global tech position. The opinion piece, published across eight European countries, highlights growing concerns over competitiveness and innovation.For...
SEMI appoints Julie Rogers as ESD Alliance leader
Julie Rogers has been appointed as the new Executive Director of the Electronic System Design Alliance (ESDA) by SEMI, enhancing the leadership team for the electronic design automation (EDA) and semiconductor design ecosystem. She takes over from Robert P. Smith, who will...
FlexIC RFID inlays bring NFC to paper packaging
Tageos and Pragmatic Semiconductor have strengthened their collaboration by introducing new FlexIC-based RFID product lines tailored for NFC-enabled packaging and labels. The Tageos EOS Lite and EOS Zero Lite families leverage Pragmatic’s NFC Connect PR1301 chip, with the EOS-932 Zero Lite PR1301...
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