SEMI Summit spotlights Europe’s chiplet and packaging push

Europe’s semiconductor industry is gearing up for the SEMI 3D & Systems Summit in Dresden, Germany, set to take place from June 17–19. This event will shine a spotlight on advanced packaging and heterogeneous integration, bringing together key players in the industry such as chipmakers, equipment suppliers, and research organizations. Discussions will revolve around AI hardware, chiplets, hybrid bonding, and co-packaged optics, showcasing the latest innovations and trends in semiconductor technology.

As Europe aims to solidify its position in the semiconductor market amidst global challenges and the increasing demand for AI-focused hardware platforms, the summit serves as a platform for showcasing where European companies and research institutes are directing their investments and efforts in next-generation semiconductor packaging and system integration technologies.

AI and Chiplets at the Forefront

With the theme “Enabling Next-Gen Heterogeneous Systems Integration,” the conference agenda will delve into various aspects ranging from advanced packaging capabilities and AI system architectures to AR/VR devices and wearable intelligence. A key focus will be on Europe’s emerging chiplet ecosystem, exploring topics like 3D integration strategies, CPU startups, and system-level semiconductor design. Additionally, discussions will cover hybrid bonding technologies for high-density integration and memory stacking.

Photonics and co-packaged optics will also take center stage as the industry seeks more efficient ways to handle data in AI accelerators and high-performance computing systems, reflecting the ongoing drive for innovation and optimization in semiconductor technologies.

Laith Altimime expressed anticipation for the upcoming summit, emphasizing its role in facilitating collaboration among industry leaders, innovators, and researchers. As heterogeneous integration, chiplet architectures, and advanced packaging redefine system performance, the event aims to align technology roadmaps, foster innovation, and bolster Europe’s standing in next-generation semiconductor systems.

Notable Speakers and Abstract Submissions

The event boasts a lineup of industry heavyweights from companies like ASML, GlobalFoundries, NXP Semiconductors, and STMicroelectronics, as well as representatives from renowned research organizations such as imec and CEA-Leti. In parallel with the summit, SEMI Europe has announced the call for abstracts for its 2026 Advanced Packaging Conference, focusing on power and interconnect innovations tailored for AI systems, HPC, automotive applications, and edge computing, further underscoring the industry’s commitment to driving advancements in semiconductor technology.