News Archive
“Elektor Online Conference Seeks Presentations on RISC-V”
Exciting Opportunities: Call for PresentationsAre you passionate about cutting-edge technology and eager to share your expertise with a global audience? Elektor is currently inviting submissions for presentations that will captivate and enlighten attendees at an upcoming event. We are on the lookout...
Infineon Flex SDV Zone Controller Kit
Infineon Technologies and Flex have come together to introduce a joint development platform with the goal of expediting the transition towards zonal E/E architectures in software-defined vehicles. The upcoming zone controller development kit, set to be unveiled at CES 2026, is positioned...
METI budget hike Japan lifts chip and AI funding for FY 2026
Japan is gearing up to significantly increase its industrial policy spending in the fiscal year 2026, with the Ministry of Economy, Trade and Industry (METI) planning a substantial rise in its overall allocation to approximately ¥3.07 trillion. A major highlight of this...
Afeela Prototype 2026 EV Update at Sony’s CES
Sony’s traditional CES press-conference slot has effectively become a Sony Honda Mobility update, with the joint venture using CES 2026 to push its Afeela EV roadmap rather than Sony’s usual spread of TVs, cameras and entertainment. In Las Vegas on 5 January 2026 (local time),...
Humanoid Robotics Market Outlook for UK Industry
The humanoid robotics market is poised for significant growth in the coming decades, with projections suggesting it could reach several trillion dollars. In the UK, this potential trajectory is no longer a distant vision but a reality that is already shaping industrial...
Biren IPO in Hong Kong Surges 76%
Chinese AI chip developer Shanghai Biren Technology has kicked off Hong Kong’s 2026 new listings with a sharp first-day rise, as investors continue to chase domestically developed alternatives to US-restricted compute hardware.nBiren IPO: a strong first daynBiren priced its shares at HK$19.60...
Bosch Sensortec and Espressif collaborate on ESP SensairShuttle
Bosch Sensortec and Espressif have entered into a strategic agreement focused on a modular sensor development platform known as ESP SensairShuttle. The main objective of this collaboration is to streamline the process of prototyping and validating multi-sensor designs by combining Bosch Sensortec...
PowerCo Launches European Battery Cell Production in Salzgitter
PowerCo has recently launched European battery cell production at its Salzgitter facility in Germany, marking the inauguration of the first gigafactory dedicated to the Volkswagen Group’s Unified Cell strategy. This move signifies a significant step towards localizing battery value chains in Europe,...
US Chipmaking Tool Exports to China Approved Annually
The US government has granted annual approvals allowing major semiconductor manufacturers to continue importing US-origin chipmaking equipment into their facilities in China. The decision affects TSMC, Samsung Electronics, and SK Hynix, all of which operate advanced fabrication plants on the Chinese mainland.According...
onsemi and FORVIA HELLA extend collaboration on automotive power MOSFETs
onsemi and FORVIA HELLA have extended their long-standing strategic collaboration, formalising a new long-term agreement focused on next-generation automotive power MOSFETs technology. The deal centres on the adoption of onsemi’s PowerTrench T10 MOSFETs across FORVIA HELLA’s advanced automotive platforms, reflecting the increasing...
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