News Archive
A football field in a teaspoon: New material has insane surface area
Using principles from rocket science, researchers have created carbon with a record-breaking surface areaThe material can soak up about twice the amount of CO2 as current activated carbon materials and has impressive energy-storage capabilities. As you might remember from combining baking soda...
Tiny MEMS speaker-microphone for TWS devices
SonicEdge has launched SonicTwin, the first integrated MEMS speaker-microphone in a single package for True Wireless Stereo (TWS) earbuds and headphones.The tiny MEMS speaker-microphone measures just 8- x 4- x 1-mm and combines cutting-edge sound generation and sensing capabilities to set a...
3D UWB radar SoC offers 1.8 GHz programmable bandwidth
ARIA Sensing has launched “Hydrogen,” a groundbreaking UWB radar SoC that sets a new industry benchmark as the first to offer 3D beamforming with programmable bandwidth up to 1.8 GHz. As a result, Hydrogen can use different center frequencies to operate worldwide...
Honda, Nissan detail merger plan, add Mitsubishi
Honda and Nissan have signed a memorandum of understanding (MOU) to start discussions on a joint holding company. A separate MoU explores a further merger with Mitsubishi.This follows an MOU back in March for a strategic partnership for the era of vehicle...
Collaboration brings extended test capabilities for GMSL-based devices
Rohde & Schwarz has collaborated with Analog Devices (ADI) to create a wide range of tests for gigabit multimedia serial link (GMSL) devices.The GMSL technology from ADI provides a cost-efficient, scalable, and simple SerDes solution designed to improve performance for high-speed video...
Agratas buys battery R&D centre in Oxford
Battery maker Agratas has bought a new R&D facility in the UK to serve as its technology hub. The 22,857 sq ft (2,123 sq m) facility at Milton Park, Oxford, will serve as the company’s UK technology hub, further strengthening its global...
UCIe scales to 64 Gbit/s for 3nm chiplet interconnect
Alphawave Semi has shown the industry’s first 64 Gbit/s Die-to-Die (D2D) IP subsystem for the Universal Chiplet Interconnect Express (UCIe).The third generation IP, built on a 3nm process in both standard and advanced packaging at TSMC, follows the most recent Gen2 36...
Physicists magnetize a material with light
The technique provides researchers with a powerful tool for controlling magnetism, and could help in designing faster, smaller, more energy-efficient memory chips – MIT news
US cuts funding for Amkor packaging plant, Samsung fab
The US government has confirmed nearly $5bn for Samsung fabs in Texas and $407m for Amkor in Arizona for packaging, both cut by 20% since the original announcements.The $407m funding for Amkor Technology Arizona, a subsidiary of Amkor Technology, will directly support...
X-fab boosts SiC foundry process
X-fab has enhanced its silicon carbide (SiC) process in Lubbock, Texas, for foundry customers.The Belgian foundry has improved the capability of the lithography, deposition and etch tools and made major process flow changes from the previous generation for the XSICM03 next-generation XbloX...
Partner with us