News Archive
Eliyan ports chiplet interconnect to Samsung 4nm process
Eliyan has taped out of its NuLink chiplet on Samsung Foundry’s SF4X 4nm following a test chip on TSMC’s 3nm process.The Nulink PHY in a x64 UCIe Advanced Package Module will see initial silicon for characterization in Q1 2025.The high-performance chiplet interconnect...
5D imaging radar for L3+ systems
Provizio in Ireland has launched its 5D imaging radar system with over the air updates and support for processing camera and LiDaR data.The VizioR&I combines the Provizio 4D VizioPrime imaging radar with Nvidia’s Orin GPU for real-time all-weather perception and can be...
BYD Semiconductor shows automotive controller chips
BYD’s chip design spinout has been working with TSMC and Mediatek on a central automotive controller chip and a 4nm smart cockpit chip.The central controller chip designed by BYD Semiconductor is reported to have a performance of 80TOPS for its smart driving...
TSMC drives A16, 3D process technology
TSMC is looking to introduce its A16 1.6nm process by the end of 2026 with an IEEE standard for its 3Dblox technology.The Open Innovation Platform (OIP) meeting in the Netherlands this week showed that the 2nm process will be in production in...
Sony sensor quadruples performance for industrial imaging
Sony Semiconductor has launched a 25Mpixel image sensor with a global shutter at 394 frame/s for high speed industrial automation.The IMX925 stacked CMOS image sensor has a back-illuminated pixel structure with a high, 24.55-effective-megapixel count and is optimized for industrial equipment imaging.A...
Compact 3D low-power ToF sensor delivers high performance
TOPPAN Holdings developed its first-generation 3D ToF (Time of flight) sensor for robotics in 2023, using hybrid ToF™ technology to enable long-range measurement, tolerance to outdoor environments, high-speed sensing, and simultaneous use of multiple devices.The company has now further enhanced the first-generation’s...
First complete memory interface for next generation DDR5 server MRDIMMs
Renesas Electronics Corporation has delivered the industry’s first complete memory interface chipset for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).New DDR5 MRDIMMs are needed to keep pace with the ever-increasing memory bandwidth demands of AI, HPC and other data...
Report: Robotics advances to drive human-machine collaboration
Molex has issued a thought leadership report that looks at the future potential of robotics, resulting in more intuitive, intelligent and interconnected human-machine communications and collaborations.The report considers a future where highly advanced robotics systems and multipurpose robots transform fundamental aspects of...
New on-chip device uses exotic light to detect molecules
The compact design and room-temperature operation of the device hold promise for developing ultra-compact platforms for molecular and gas sensing applications – ICFO newsResearchers have developed a highly sensitive detector for identifying molecules via their infrared vibrational “fingerprint”. Published in Nature Communications,...
D-Wave shows 4400 qubit annealing quantum processor
D-Wave in Canada has completed the calibration and benchmarking of a 4,400+ qubit annealing processor.The Advantage2 will be key to D-Wave’s ongoing development of its sixth-generation annealing quantum computing system with a substantial performance boost over the current Advantage system for optimization,...
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