News Archive
Silicon Box Chooses Novara for Italian Chiplet Fab Site
If Novara is confirmed as the location for Silicon Box's new chiplet factory, it would be situated near a 300mm wafer plant constructed by MEMC Electronic Materials SpA, the Italian subsidiary of GlobalWafers Co. Ltd. of Taiwan, which recently received a €100...
dSPACE Teams Up with AWS for Natural Language AI Testing
The automotive industry is on the brink of a major breakthrough in autonomous vehicle testing thanks to the collaboration between dSPACE and the AWS Generative AI Innovation Center. This partnership has led to the development of a cutting-edge scenario generation feature that...
Chip Manufacturing Capacity Expansion to Persist
Leading-edge capacity, defined as being for 5nm nodes and under, is expected to grow 13 percent in 2024, chiefly driven by generative artificial intelligence (AI) for data center training, inference, and leading-edge devices. Intel, Samsung, and TSMC are poised to start production...
Revolutionary Holographic Windscreen Unveiled
Ceres Holographics, based in Scotland, has achieved a groundbreaking milestone in the automotive industry by introducing the world's first fully integrated windscreen featuring multiple holographic optical elements (HOEs) within a single laminate.The innovative holographic windscreen, developed in collaboration with Eastman in the...
IoT Satellite Test Support Added to Antenna Measurement System
ETS-Lindgren and Anritsu have joined forces to provide enhanced test support for devices utilizing the Narrow Band NTN (NB-NTN) protocol. This collaboration aims to offer a comprehensive solution for testing and validating Narrowband NTN devices that facilitate the connection of IoT devices...
Dutch Launch Consultation on Fiber Optic Industry’s Environmental Impact
Dutch trade association NLconnect has initiated a consultation process focusing on passive and active components for fibre optic network components. This move comes as NLconnect is actively involved in drawing up Life Cycle Assessments (LCA) for active components and passive materials within...
Baya Systems Unveils Chiplet Interconnect Technology – Update
Baya Systems, a company that has recently emerged from stealth mode, is making waves in the semiconductor industry with its cutting-edge interconnect tool designed for chiplet and complex system on chip (SoC) architectures. According to Nandan Nayampally, the chief commercial officer of...
Microsoft Abandons Subsea Datacenter Project
Microsoft has announced the conclusion of its innovative underwater datacentre project in the UK. The Natick project, which took place from 2018 to 2020, aimed to test a sealed subsea datacentre off the coast of the Shetland Isles. The project yielded promising...
Unveiling the Invisible: Turning Infrared Light Visible
Up-conversion of light holds significant potential across various fields, particularly in defence and optical communications. A groundbreaking development by the team at the Indian Institute of Science (IISc) introduces a novel approach using a 2D material to create a non-linear optical mirror...
Capacitor Power Solution for Medical Lasers
Advanced Energy Industries has recently unveiled its latest innovation in the field of power supplies for medical lasers - the FlexiCharge FC2500. This new 800W system is designed to cater to the evolving needs of medical laser systems and electrosurgery applications, offering...
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