News Archive

APEC 2024: Rohm’s Latest GaN and SiC Developments

APEC 2024: Rohm’s Latest GaN and SiC Developments

Long Beach, CA: Rohm Semiconductor has made significant strides in the ongoing GaN vs SiC debate within the industry. Recently, the company announced a major design win for its 650V GaN device, the EcoGaN, in the development of the 45W output USB-C...

Published on: March 08, 2024

Advantech Single-Board Computers Now Available at Farnell in EMEA

Advantech Single-Board Computers Now Available at Farnell in EMEA

Component distributor Farnell has expanded its product offerings in the EMEA region by introducing industrial single-board computers to its line card. This strategic move is part of Farnell's plan to enhance its global selection in the upcoming months, with a specific focus...

Published on: March 08, 2024

Taalas Chip Revolutionizes AI Cost Reduction by 1000x

Taalas Chip Revolutionizes AI Cost Reduction by 1000x

Taalas, a groundbreaking technology company, has recently emerged from stealth mode with a revolutionary chip design that has the potential to transform the landscape of artificial intelligence. The company claims that their innovative chip can outperform a small GPU data center, paving...

Published on: March 08, 2024

Samsung Begins Sampling Solid State Batteries

Samsung Begins Sampling Solid State Batteries

Samsung has announced that it is making significant strides in the development of solid-state batteries for electric vehicles and other applications. The company has already started sampling these advanced batteries to car manufacturers and plans to commence mass production by 2027. This...

Published on: March 08, 2024

Taalas Chip Paves the Way for 1000x Reduction in AI Costs

Taalas Chip Paves the Way for 1000x Reduction in AI Costs

Taalas, a groundbreaking technology company, has recently emerged from stealth mode with a revolutionary chip design that has the potential to transform the landscape of artificial intelligence. The company claims that their innovative chip can outperform a small GPU data center, paving...

Published on: March 08, 2024

Digi-Key Unveils Farm Different Season 3

Digi-Key Unveils Farm Different Season 3

DigiKey is excited to announce the launch of Series 3 of their video sequence titled 'Farm Different', focusing on the latest advancements in agri-tech.The series comprises three episodes that delve into the future of farming, exploring the innovations that will drive the...

Published on: March 08, 2024

Cadence Acquires BETA CAE

Cadence Acquires BETA CAE

Cadence, a leading technology company, has announced its plans to acquire BETA CAE, a specialist in system analysis simulation. This strategic move is aimed at accelerating Cadence’s Intelligent System Design strategy by expanding its multiphysics system analysis portfolio and venturing into the...

Published on: March 08, 2024

Power Integrations Introduces InnoMux IC to Challenge Post Regulators

Power Integrations Introduces InnoMux IC to Challenge Post Regulators

At the APEC 2024 conference, Balu Balakrishnan, the chairman and CEO of Power Integrations, made a bold statement as he "declared war on DC-DC post regulators" while unveiling the innovative GaN-based InnoMux-2 switcher IC family. This new product line showcases the company's...

Published on: March 07, 2024

UKESF and Apple Team Up to Empower Girls in Electronics

UKESF and Apple Team Up to Empower Girls in Electronics

Apple is continuing its partnership with the UK Electronics Skills Foundation (UKESF) programme Girls into Electronics 2024, with the goal of encouraging young girls to explore potential careers in the electronics industry.Having backed the initiative in the previous year, Apple has expanded...

Published on: March 07, 2024

Cutting-Edge Industrial Cameras Featuring Sony IMX662 Sensor

Cutting-Edge Industrial Cameras Featuring Sony IMX662 Sensor

Imaging Development Systems (IDS) has unveiled its latest offering featuring Sony's IMX662 1/2.45 inch 2.16 Mpixel sensor, available in both colour and monochrome cameras. The U3-38C0XCP model is housed in a compact 29 x 29 x 17mm zinc die-cast casing with an...

Published on: March 06, 2024

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