News Archive
US completes chip R&D trio with Arizona 300mm centre
Arizona is to host what the US says is the world’s first 300mm front-end semiconductor manufacturing and advanced packaging research facilityThe US Department of Commerce and Natcast announced the Arizona State University (ASU) Research Park in Tempe, Arizona as the anticipated location...
HARMAN adds empathy and contextual awareness to vehicles
HARMAN, subsidiary of Samsung Electronics Co., Ltd., is unveiling the next evolution of its groundbreaking innovations — a suite of intelligent, contextual technologies and products that are making vehicles not only smarter but empathetic.The technology aims to enable vehicles that not only...
NXP to buy TTTech Auto for $625m
NXP Semiconductors is to buy Austrian automotive software developer TTTech Auto for $625m in cash as part of its move into software defined vehicles.TTTech Auto has established business relationships with many leading automotive OEMs through its deterministic operating system and time triggered...
Nexperia expands energy harvesting portfolio with PMIC
Nexperia is expanding its energy harvesting portfolio with the NEH71x0 power management IC (PMIC) family. This advanced PMIC line combines superior performance, cost-efficiency, and versatility, setting a new standard in sustainable design for low power applications.Unlike competing products, these PMIC devices eliminate...
Dell, Intel show Ventiva silent ultrathin laptop concept
Ventiva in the US has worked with Dell and Intel to replace mechanical fans with electronic airflow, showing off a proof-of-concept thin laptop design.Ventiva’s ion-based ICE9 thermal management suite is based on the company’s patented Ionic Cooling Engine (ICE) technology. This eliminates the need...
Collaboration uses digital twins, AI to optimise supply chains
KION has teamed up with NVIDIA and Accenture to optimize supply chains with AI-powered robots and digital twins.At CES 2025 the three companies are showcasing how clients can both define ideal set-ups for new warehouses and continuously enhance existing facilities with Mega,...
IMU-based gesture control for low-power wearables
When designing wearable devices, IMU-based gesture control requires less power, extending device battery life compared to camera or vision-based systems. The Bosch Sensortec BHI360 smart IMU sensor enables designers to achieve a compact form factor while ensuring ease of use and intuitive...
Septentrio adds high-accuracy GEODNET GNSS correction services
Septentrio has announced that GEODNET GNSS correction services is being added to its Agnostic Corrections Partner Program, which provides users with the flexibility to choose from a variety of high-accuracy correction services, ensuring compatibility with diverse application needs and geographical requirements.GEODNET (Global...
Imagination pulls out of RISC-V CPUs
Imagination Technology in the UK has shut down its development of RISC-V processor cores to focus on its GPU and AI products.“Imagination exited its standalone line of CPUs to increase our investment in graphics, AI and compute at the edge which we...
Teledyne FLIR thermal imaging passes vehicle emergency braking tests
Teledyne FLIR OEM is working with VSI Labs to use thermal imaging for vehicle testing for the latest US standards for nighttime safety.The test results used the latest Federal Motor Vehicle Safety Standard (FMVSS) No. 127 pedestrian automatic emergency braking (PAEB) testing scenarios. These standards for nighttime...
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