European board maker MikroE has launched a Click board for long distance bi-directional 915MHz LoraWAN data communications in the US.The LR 11 Click board uses Ezurio’s 453-00139R LoraWAN module which integrates the Silicon Labs EFR32 SoC and the Semtech SX1262 radio. It...
Renesas Electronics has launched two microcontroller families with a focus on low power operation for consumer designs.The 64MHz RX261 and RX260 microcontroller (MCU) groups have a power efficiency of 69μA/MHz during active operation and 1μA in standby mode. They also enable designers...
Quantum Dice Ltd., a pioneer of quantum random number generator (QRNG) technology, has signed a cooperation agreement with SCI Semiconductor Ltd. (Cambridge, England), a developer of secure semiconductor systems.Quantum Dice is a 2020 spin-out from the University of Oxford while SCI Semiconductor...
Global shipments of silicon wafers are set to decline in 2024 before a strong rebound in 2025, according to industry organization SEMI.Global shipments of silicon wafers are projected to decline 2 percent in 2024 to 12,174 million square inches (MSI) with 10...
German processor designer Codasip has donated its newly developed RISC-V Software Development Kit (SDK) for CHERI to the community-interest organization CHERI AllianceThe Alliance is making the SDK freely available for download on GitHub to provide open access to the complete SDK with Linux...
RISC-V chip developer SiFive is shipping a development board based on its P550 core.The Premier P550 board marks a fundamental shift in the RISC-V board strategy by the company with a new partnership programme.The Premier P550 uses a quad core 1.4GHz RISC-V...
The US government is backing Hemlock Semiconductor (HSC) with a $325m grant to expand local production of ultra-pure polysilicon.Founded in 1961 in Michigan, HSC is the only US-based manufacturer of hyper-pure polysilicon and is one of just five companies in the world...
Winner of the contest will receive €50,000 in services from the ecosystem, backed by a €60 million startup fund – The engineering contest is a global competition for innovative ideas for PIC-based solutions that address some of the world’s most pressing societal...
Researchers at Delft University of Technology and MIT have developed a novel 3D printing technique called Speed-Modulated Ironing, enabling high-resolution surface textures and colour gradients using just a single materialMaterial extrusion 3D printing is being used for an increasingly wide range of...
Kioxia is showing several emerging memory technologies it is developing at the IEDM 2024 conference in December.The emerging memory technologies include a new type of DRAM using oxide semiconductors with a focus on reducing power consumption, MRAM suitable for larger capacities for...