News Archive
New Low Power MCU Portfolio with Wi-Fi 6/6E and Bluetooth Integration
The latest offering from Infineon Technologies, the flexible MCU platform, is set to revolutionize the IoT industry by accelerating customers’ time-to-market with a range of cutting-edge features. This platform comes equipped with ModusToolbox ™ software, RTOS and Linux host drivers, a fully...
Rohde & Schwarz Joins AI-RAN Alliance for 5G/6G Advancement
The renowned technology company Rohde & Schwarz has reached a significant milestone on its journey towards 6G by becoming a member of the AI-RAN Alliance. This move signifies a deepening of the company's collaboration with industry leaders in the development of AI-native...
Innoscience Seeks USPTO Ruling on Infineon GaN Patent
Infineon's US Patent No. 9,899,481 lies at the center of legal disputes initiated by Infineon against Innoscience in both the United States and Europe. Innoscience Technology Co. Ltd., based in Zhuhai, China, has raised concerns regarding the validity of the patent in...
Enhanced Speech Recognition for Augmented Reality
Augmented reality (AR) technology is rapidly advancing, offering a wide array of possibilities to enhance everyday experiences. At the forefront of this innovation is the potential for AR to revolutionize communication through speech recognition models. Researchers have been exploring the use of...
Tenstorrent Partners with Baya Systems for AI/RISC-V Chiplet Technology
Baya Systems and Tenstorrent have joined forces to revolutionize the world of chiplet technology. Baya’s IP and software flow have empowered Tenstorrent and its partners to analyze, customize, and deploy its intelligent compute platform for current and future workloads. This collaboration aims...
Silicon Box Chooses Novara for Italian Chiplet Fab Site
If Novara is confirmed as the location for Silicon Box's new chiplet factory, it would be situated near a 300mm wafer plant constructed by MEMC Electronic Materials SpA, the Italian subsidiary of GlobalWafers Co. Ltd. of Taiwan, which recently received a €100...
dSPACE Teams Up with AWS for Natural Language AI Testing
The automotive industry is on the brink of a major breakthrough in autonomous vehicle testing thanks to the collaboration between dSPACE and the AWS Generative AI Innovation Center. This partnership has led to the development of a cutting-edge scenario generation feature that...
Chip Manufacturing Capacity Expansion to Persist
Leading-edge capacity, defined as being for 5nm nodes and under, is expected to grow 13 percent in 2024, chiefly driven by generative artificial intelligence (AI) for data center training, inference, and leading-edge devices. Intel, Samsung, and TSMC are poised to start production...
Revolutionary Holographic Windscreen Unveiled
Ceres Holographics, based in Scotland, has achieved a groundbreaking milestone in the automotive industry by introducing the world's first fully integrated windscreen featuring multiple holographic optical elements (HOEs) within a single laminate.The innovative holographic windscreen, developed in collaboration with Eastman in the...
IoT Satellite Test Support Added to Antenna Measurement System
ETS-Lindgren and Anritsu have joined forces to provide enhanced test support for devices utilizing the Narrow Band NTN (NB-NTN) protocol. This collaboration aims to offer a comprehensive solution for testing and validating Narrowband NTN devices that facilitate the connection of IoT devices...
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