Atos has recently unveiled its latest addition to the global network of Modern Security Operations Centers (MSOC) in Seville, Spain. This state-of-the-art facility is already operational 24/7 and is specifically designed to bolster the detection, response, and management of cyber incidents across...
The global market for MEMS packaging substrates is projected to grow from USD $2.40 billion in 2025 to USD $3.23 billion by 2030, according to a MarketsandMarkets report. The growth is being driven by the expanding medical device sector, accelerating 5G deployment,...
The implementation of AI is shifting away from the Cloud to the Edge. Bandwidth and latency are key issues when conducting inferencing in the Cloud for Edge applications, making inference at the source critical for many IoT applications. As a result, the...
Microchip Technology has introduced its new SkyWire time measurement technology, designed to deliver nanosecond-level synchronization and verification for large-scale, distributed timing networks. Embedded in the company’s BlueSky GNSS Firewall against spoofing and jamming of navigation systems, SkyWire extends precise time traceability from...
Siemens and Capgemini have announced an expansion of their partnership to focus on developing a new generation of AI-native digital solutions for product engineering, manufacturing, and industrial operations. Unlike traditional approaches of adding AI as an afterthought, these solutions will have AI...
BASF has announced plans to build a new NH4OH plant at its Ludwigshafen site in Germany, aimed at reinforcing the semiconductor materials supply chain in Europe. The ammonium hydroxide facility will produce ultra-pure chemicals used in wafer cleaning, etching and other steps...
Hyundai Motor Group has announced an expansion of its collaboration with NVIDIA, a leading technology company, to accelerate development in autonomous driving, robotics, and smart factories. This partnership also involves cooperation with the Korean government to build national AI infrastructure and nurture...
Infineon Technologies has introduced a new line of SiC power modules within its EasyPACK C family, specifically designed for high-power industrial applications such as fast DC EV charging, megawatt charging systems, energy storage, and UPS equipment. These modules are equipped with Infineon’s...
Boston Dynamics and UAE-based technology company Analog have announced an exclusive alliance to deploy “Physical Intelligence” across the United Arab Emirates, beginning with Boston Dynamics’s four-legged Spot robots. The initiative aims to enhance urban operations—from park inspections and environmental monitoring to predictive...