News Archive

Power Conversion for AI Chips

Power Conversion for AI Chips

Amber Semiconductor is set to unveil a groundbreaking power conversion technology designed specifically for datacentres, promising to significantly reduce the energy losses associated with AI chips. The innovative solution will be showcased at the 2025 Applied Power Electronics Conference (APEC), where attendees...

Published on: March 04, 2025

Keysight teams up for custom noise injection in MultiGBASE-T1 test system

Keysight teams up for custom noise injection in MultiGBASE-T1 test system

Keysight Technologies has partnered with a test provider in Germany to enhance its Automotive Ethernet Receiver Compliance test by adding support for MultiGBASE-T1 data rates. The Receiver Test compliance software for Automotive Ethernet MultiGBASE-T1 now features a custom Noise Injection Fixture designed...

Published on: March 04, 2025

IBM Granite – let’s get visual!

IBM Granite – let’s get visual!

IBM Research embarked on a groundbreaking project to develop an open-source vision-language model (VLM) capable of analyzing a wide range of visual data, including natural images, charts, tables, and other data visualizations commonly found in enterprise reports. This innovative model represents a...

Published on: March 03, 2025

Clock attack monitor enhances analog IP security

Clock attack monitor enhances analog IP security

Agile Analog has developed a range of anti-tamper IP to protect analog chip designs. The analog IP has been delivered to a major datacentre chip designer in Taiwan that can be used on multiple process technologies.The analog security IP includes a Clock...

Published on: March 03, 2025

“Ultimate All Terrain Robot: GOAT Mode”

“Ultimate All Terrain Robot: GOAT Mode”

Researchers at the CREATE Lab in EPFL’s School of Engineering, led by Josie Hughes, have developed a groundbreaking morphing robot named GOAT (Good Over All Terrains). The primary goal behind this innovative creation was to design a robot capable of navigating various...

Published on: March 03, 2025

HARMAN introduces in-vehicle alerts for Euro NCAP 2026

HARMAN introduces in-vehicle alerts for Euro NCAP 2026

During the Mobile World Congress in 2025, HARMAN, a subsidiary of Samsung Electronics Co., Ltd., and HERE Technologies made a significant announcement regarding their collaboration. The two companies revealed their joint efforts to develop advanced, direct, cloud-based vehicle-to-everything (V2X) driver assistance systems....

Published on: March 03, 2025

POLYN Neuromorphic Tire Monitoring Evaluation Kit

POLYN Neuromorphic Tire Monitoring Evaluation Kit

POLYN has recently made a significant announcement by releasing the VibroSense Tire Monitoring Evaluation Kit for general availability. This evaluation kit is designed to assist automotive, ADAS, and tire vendors in initiating the integration and design processes for intelligent tire monitoring systems...

Published on: March 03, 2025

Solid State Electrolyte for Greener Lithium Production

Solid State Electrolyte for Greener Lithium Production

Researchers in the US have made a significant discovery regarding the potential dual functionality of the electrolyte used in solid-state batteries. The team at Rice University found that the solid-state electrolyte, which facilitates the movement of lithium ions within the battery, can...

Published on: March 03, 2025

Keysight Ericsson Collaboration on Pre-6G cmWave Testbed

Keysight Ericsson Collaboration on Pre-6G cmWave Testbed

Keysight Technologies and Ericsson have joined forces to establish a cutting-edge pre-6G radio access test setup in the centimetre Wave (cmWave) frequency band spanning from 7 to 15GHz. This innovative testbed is designed to create a cmWave communication link between an Ericsson...

Published on: March 03, 2025

Cellular IoT chips with 5G eRedCap

Cellular IoT chips with 5G eRedCap

Sequans Communications has unveiled two cutting-edge third-generation low-power cellular IoT chips within its flagship Calliope and Monarch IoT product families at the prestigious Mobile World Congress 2025. These chips are designed to facilitate a seamless transition from the 4G low-speed modem categories...

Published on: March 03, 2025

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