Advanced chiplet packaging deal in Arizona

Materials and process IP developer LQDX has signed a deal with Arizona State University (ASU) on advanced chip and chiplet substrates, Fan Out Wafer Level Packaging (FOWLP) and glass core metallization.

As the demand for computing power skyrockets with the rapid rise of AI and ML computing, new tools are needed in the semiconductor packaging and Ultra High-Density Interconnect (UHDI) toolbox.

• $1.6bn for advanced packaging R&D projects
• $75m for chiplets on glass substrates 

The LQDX metallization enables the production of circuits up to 250 times denser than conventional Printed Circuit Boards (PCBs). These advanced features, previously exclusive to silicon, can be used on substrates for chips and chiplets.

ASU is leading the Advanced Packaging Piloting Facility (PPF) created through the CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP). This centre will allow researchers to test new materials, devices, and advanced packaging in a state-of-the-art R&D environment.

LQDX, founded in collaboration with the Stanford Research Institute (SRI), will provide ASU with the Liquid Metal Ink (LMIx) chemistries and process IP for semiconductor packaging that can be used in the US. This is part of the move to provide a sovereign packaging ecosystem for AI chiplet devices.

“ASU is the new centre of gravity of US semiconductor and packaging innovation,” said Simon McElrea, CEO of LQDX. “Coupled with the recent CHIPS investments and large-scale manufacturing builds from TSMC and Amkor, there is no better development partner for LQDX. This agreement takes the research partnership we initiated in 2024 to the next level and is focused on the delivery of next generation IC-substrates and advanced semiconductor packaging solutions as enabled by our PVD-in-a-Bottle technology.”

“It is our vision to develop and scale cutting-edge semiconductor technologies that further the economic interests of the State of Arizona and the US as a whole, and we welcome LQDX to the AZ ecosystem,” said Professor Hongbin Yu of Arizona State University.