Applied Materials Invests in Dutch Firm BESI

US chip manufacturing equipment maker Applied Materials has recently acquired a 9 percent stake in BE Semiconductor Industries NV, a leading manufacturer of advanced packaging equipment based in Duiven, The Netherlands. The exact amount paid for this stake has not been disclosed by Applied, suggesting that the acquisition may have been a gradual process spanning several years.

Since 2020, Applied and BESI have been working together on developing hybrid bonding technology, which facilitates direct copper-to-copper connections between chips. This innovation allows for higher interconnect density and shorter wiring between chiplets, enhancing overall performance and efficiency.

Expressing the significance of this investment, Terry Lee, the general manager of heterogeneous integration and packaging at Applied Materials, emphasized the strategic nature of the move. Lee stated, "We view this as a strategic, long-term investment that demonstrates Applied Materials’ commitment to co-developing the industry’s most capable hybrid bonding solution, a technology that is becoming increasingly important to the advanced logic and memory chips at the foundation of AI."

Applied Materials clarified that the investment in BESI was carried out through market-based transactions and does not require any regulatory approvals. Furthermore, the company affirmed that it has no intentions of seeking board representation at BESI or acquiring additional shares in the near future.

This collaboration between Applied Materials and BESI underscores the growing importance of advanced packaging solutions in the semiconductor industry. As demand for high-performance chips continues to rise, technologies like hybrid bonding are poised to play a crucial role in enabling next-generation applications in areas such as artificial intelligence, data centers, and autonomous vehicles.