Asahi Kasei to Double PSPI Production Capacity by 2030

Asahi Kasei, a leading materials manufacturer, has announced its ambitious plan to double the production capacity of photosensitive polyimide (PSPI) for semiconductors by 2030. This strategic move involves investing ¥16 billion (€100m) in its Fuji City facility in Japan, emphasizing the company’s dedication to enhancing the supply resilience of crucial semiconductor materials.

The expansion initiative not only signifies Asahi Kasei’s commitment but also sheds light on the increasing demand for advanced semiconductor packaging materials. It underscores the significance of supply-chain strategies that will play a pivotal role in shaping the industry’s upcoming growth cycle, particularly in meeting the surging demand for semiconductors.

Meeting surging semiconductor demand

Photosensitive polyimide (PSPI) is a key component in semiconductor manufacturing, utilized for various purposes such as buffer coatings, passivation layers, and redistribution layers (RDL) in advanced packaging. With the global chip industry expected to exceed $1 trillion in annual revenue by the mid-2030s, Asahi Kasei is aligning its production capacity to meet the accelerating market requirements.

Having recently completed the construction of a new PIMEL™ plant in Fuji City in December 2024, the company is now set to double its output by 2030. This expansion aims to ensure a stable global supply of PSPI, which is crucial for enabling cutting-edge technologies like generative AI.

Nobuko Uetake, Senior Executive Officer of Asahi Kasei, emphasized the importance of this investment, stating, “The rapid growth of generative AI and other advanced technologies is fueling unprecedented demand for semiconductor materials like PIMEL™ PSPI. This investment positions Asahi Kasei to capitalize on that growth by enhancing our supply capability and solidifying our role as a dependable partner to global semiconductor manufacturers."

Strategic growth and industry recognition

Asahi Kasei has strategically placed its electronics business in the company’s “First Priority” category, identifying it as a key growth driver through 2030 and beyond. The company’s approach, outlined in its medium-term management plan Trailblaze Together, focuses on selected high-growth sectors, with semiconductors taking precedence.

PIMEL™ plays a critical role in semiconductor manufacturing by providing protection, adhesion, and optimized electrical connectivity for advanced packaging. In recognition of its contributions, TSMC awarded Asahi Kasei the Excellent Performance Award in 2024 for “Excellent Technology Collaboration and Production Support in Advanced Packaging,” further solidifying the company’s position in the industry.