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Automotive SoC Showcases Tensilica AI IP in Action

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June 19, 2024

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The Embedded World 2024 showcased a groundbreaking demonstration featuring the advanced driver-assistance system (ADAS) application software running on the Tensilica AI IP within the Dream Chip SoC development board. This innovative system has been a focal point of attention, offering cutting-edge solutions for the automotive industry.

Powered by the GlobalFoundries 22FDX® technology platform, the SoC developed through the ZuSE-KI-Mobil (ZuKIMo) project stands out for its energy-efficient design tailored for automotive applications. The project, based in Dresden, Germany, aims to enhance the local semiconductor supply chain by focusing on AI accelerator systems for ADAS.

The Cadence Verification, Implementation, and Signoff products have played a crucial role in ensuring the success of this SoC. By meeting stringent safety standards such as ISO 26262 ASIL-D certification, while maintaining optimal power, performance, and area targets, Cadence has enabled automotive designers to achieve remarkable results.

Furthermore, the integration of Tensilica Vision P6 DSP and AI cores, along with a range of Digital IP controllers, has enhanced the SoC's capabilities. This strategic combination of hardware components is designed to support energy-efficient ADAS applications, utilizing technologies like lidar, radar, and vision-based systems to elevate the quality, safety, and reliability of autonomous vehicles.

Dr. Jens Benndorf, CEO of Dream Chip Technologies, emphasized the collaborative effort with Cadence in delivering a comprehensive automotive solution. The successful implementation of the energy-efficient SoC underscores Dream Chip's expertise in designing advanced automotive systems, showcasing the potential of Cadence's cutting-edge technologies.

David Glasco, VP of research and development at Cadence, highlighted the significance of Tensilica IP in the ZuKIMo project, emphasizing the focus on design innovation and excellence. The powerful ADAS demo presented at Embedded World 2024 underscored the capabilities of the SoC, demonstrating the impact of Cadence's Tensilica IP in driving optimal features for automotive applications.

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