Copper-Diamond composite for AI chip cooling

UK-based Element Six (E6) has developed a copper-diamond composite material that has a high thermal and electrical conductivity for cooling AI chips and GaN RF devices.

The Cu-Diamond composite consists of diamond grit in a regular array in copper and has a thermal conductivity in the 800 W/mK range for high-demand applications. There are two variants with 35% and 45% diamond and a thickness of 0.35mm and 2mm respectively.

The substrate can be manufactured in complex shapes, allowing integration into 2.5/3D advanced packaging configurations and can also be coated with gold or nickel to improve the thermal transfer characteristics.

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As semiconductor devices have grown larger and more powerful, managing heat dissipation has become a significant challenge for the industry. More than 50 percent of all electronic device failures are heat-related, and data centres, which today consume 3.7% of total US power demand, are predicted to reach 10% by 2029. As a result, there is considerable focus on the development of thermal management materials to improve energy efficiency.

“Thermal management for semiconductor devices remains a significant challenge as power levels increase and packaging continues to advance,” said Daniel Twitchen, chief technologist at E6 at its Global Innovation Centre in Oxfordshire. “Our copper diamond composite addresses these challenges by offering a scalable and affordable solution for next-generation AI and HPC devices. This innovation empowers our customers to enhance performance and reliability, while reducing cooling costs.”

“Through the unmatched thermal conductivity and durability of diamond-based composites, we are enabling a new era of high-performance devices, not only addressing today’s challenges, but also laying the groundwork for future advancements,” said Twitchen.

Element Six will showcase this novel copper diamond composite at Photonics West 2025 in the US this week.