Copper Ink: A Game-Changer for Semiconductor and Additive Manufacturing

The electronics industry is abuzz with excitement as Electroninks unveils its latest innovation - a groundbreaking copper ink that promises to transform manufacturing processes. This new addition to Electroninks’ metal complex inks portfolio is set to provide customers with enhanced manufacturing flexibility and reduced total ownership costs.

One of the key applications for this cutting-edge copper ink is seed layer printing for fine-line metallization and RDL formation, in conjunction with Electroninks’ proprietary iSAP™ process. By utilizing the copper ink, manufacturers can eliminate the need for traditional methods such as electroless copper plating and physical vapor deposition tie layers. This not only boosts manufacturing throughput but also significantly reduces the environmental, social, and governance (ESG) footprint.

Unlike conventional methods like PVD and electroless plating, ink-based additive printing requires minimal water and energy consumption, occupies less factory space, and involves lower capital expenditure. As a result, customers can benefit from the lowest total cost of ownership and the highest return on investment in the market.

Electroninks’ copper inks can be applied using various techniques including spray coating, screen printing, inkjet, spin-on, and other conventional printing methods. Apart from seed layer applications, the company is collaborating with customers on a wide range of uses, particularly in advanced packaging for diverse markets.

According to Brett Walker, CEO and co-founder of Electroninks, “These copper inks enhance our existing MOD ink product portfolio and offer customers unparalleled environmental and cost benefits.” The introduction of copper-based MOD inks aligns with market demands, as copper is a standard material in electronic design across various applications. While silver and gold inks continue to play a role, copper MOD inks are poised to address critical requirements in advanced packaging.